Wireless communication in a flip-chip package using integrated antennas on silicon substrates

J. Branch, X. Guo, L. Gao, A. Sugavanam, Jau Jr Lin, K. K. O

研究成果: Article

40 引文 斯高帕斯(Scopus)

摘要

An intrachip wireless interconnect using integrated antennas is demonstrated in a flip-chip ball grid array package. The wireless interconnect consists of a transmitter-receiver pair, which is fabricated in a 0.18-μm CMOS process. A 15-GHz signal is generated and broadcasted across the integrated circuit. The signal is picked up by a receiver 4 mm away on the same integrated circuit and frequency divided by eight to produce a 1.875-GHz local clock signal. The interconnection is also demonstrated between a transmitting antenna and a packaged receiver 40 cm away from the transmitting antenna. Demonstration of intrachip wireless interconnects in a package has been considered the ultimate test for this technology.

原文English
頁(從 - 到)115-117
頁數3
期刊IEEE Electron Device Letters
26
發行號2
DOIs
出版狀態Published - 2005 二月 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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