The studied of the acrylic material drilling used by the CO2 laser

Ming-Fei Chen, Y. P. Chen, W. T. Hsiao

研究成果: Conference article

摘要

Laser processing which used in the 3C industry is the new technology. The PCB (printed circuit board) Laser drilling is the new manufacturing process for the PCB industry. In this paper we report the results of an investigation exploring the feasibility of laser drilling microvias. The process relies on the use of pulses from a CO2 laser to drilling small holes in the panels of acrylic. There are two part of this paper, first we will drilling the small holes of the acrylic by the different parameter of the laser (pulse width, repetitive frequency, mask size and etc.). There are two result of this paper; first we find the repetitive frequency and mask size will be change the holes diameter and depth, and the pulse width will affect the quality of the drilling holes. In Addition we can find the optimal process parameter by this paper.

原文English
文章編號104
頁(從 - 到)837-843
頁數7
期刊Proceedings of SPIE - The International Society for Optical Engineering
5448
發行號PART 2
DOIs
出版狀態Published - 2004 十二月 1
事件High-Power Laser Ablation V - Taos, NM, United States
持續時間: 2004 四月 252004 四月 30

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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