The numerical analysis of strain behavior at the solder joint and interface in a flip chip package

S. C. Chen, Y. C. Lin, C. H. Cheng

研究成果: Article同行評審

19 引文 斯高帕斯(Scopus)

指紋 深入研究「The numerical analysis of strain behavior at the solder joint and interface in a flip chip package」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science