The impact of lead-free soldering on electronics packages

L. Yang, J. B. Bernstein, Kuan-Jung Chung

研究成果: Article同行評審

10 引文 斯高帕斯(Scopus)

摘要

This paper will review the challenges brought by lead-free soldering and some preliminary experimental evaluation results will be discussed. The initial results show that the lead-free soldering process with 260 C reflow peak temperature does not directly cause failures for bismaleimide-triazine (BT)-based fine pitch ball grid array (FPBGA) packages. However, the strict lead-free soldering condition could degrade the integrity of weak interface joints and potentially damage the package in subsequent unbiased highly accelerated stress test (unbiased HAST) evaluation. The impacts of lead free soldering with high reflow temperature on concurrent available electronics components could be more severe than previously believed. In the future, new materials and design concepts should be applied to enhance the package reliability under strict lead-free soldering conditions.

原文English
頁(從 - 到)20-26
頁數7
期刊Microelectronics International
18
發行號3
DOIs
出版狀態Published - 2001 九月 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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