Template based high packing density assembly for microchip solid state cooling application

Kerwin Wang, Rajashree Baskaran, Karl F. Böhringer

研究成果: Paper

4 引文 斯高帕斯(Scopus)

摘要

100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130- 800μm.

原文English
頁面54-58
頁數5
出版狀態Published - 2006 十二月 1
事件3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006 - Snowbird, UT, United States
持續時間: 2006 四月 232006 四月 27

Other

Other3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006
國家United States
城市Snowbird, UT
期間06-04-2306-04-27

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Wang, K., Baskaran, R., & Böhringer, K. F. (2006). Template based high packing density assembly for microchip solid state cooling application. 54-58. 論文發表於 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006, Snowbird, UT, United States.