Temperature dependence of Ron,sp in silicon carbide and GaAs Schottky diode

Ji Luo, Kuan Jung Chung, Huang Hu, J. B. Bernstein

研究成果: Conference contribution

摘要

The critical properties of power devices are high reverse breakdown voltage and low forward ON state resistance, Ron,sp, during high forward current density operation. Both of these parameters are very sensitive to temperature. Nowadays silicon carbide (SiC) and GaAs are two most important materials for power device applications. SiC has been widely accepted as being superior to GaAs because it has much higher electric breakdown field, saturated electron drift velocity and thermal conductivity. In this work, the electrical performance and reliability of SiC Schottky diodes (SD) are evaluated and compared to commercially available GaAs SDs. High temperature device characterization has been performed. The specific ON resistance Ron,sp was found to increase with temperature according to T0.72 dependence for GaAs and T1.89 for SiC. The strong temperature dependence of Ron,sp is consistent with phonon scattering theory. Based on Baliga's figure-of-merit (BFOM) model, our result shows that under higher operating temperature (> 210°C) the GaAs devices have lower Ron,sp than SiC, thus, it may be preferable to use GaAs over SiC for some high temperature power applications.

原文English
主出版物標題2002 IEEE International Reliability Physics Symposium Proceedings, IRPS 2002 - 40th Annual
發行者Institute of Electrical and Electronics Engineers Inc.
頁面425-426
頁數2
2002-January
ISBN(電子)0780373529
DOIs
出版狀態Published - 2002 一月 1
事件40th Annual IEEE International Reliability Physics Symposium, IRPS 2002 - Dallas, United States
持續時間: 2002 四月 72002 四月 11

Other

Other40th Annual IEEE International Reliability Physics Symposium, IRPS 2002
國家United States
城市Dallas
期間02-04-0702-04-11

指紋

Silicon carbide
Diodes
Electric breakdown
Temperature
Phonon scattering
Thermal conductivity
Current density
Electrons

All Science Journal Classification (ASJC) codes

  • Engineering(all)

引用此文

Luo, J., Chung, K. J., Hu, H., & Bernstein, J. B. (2002). Temperature dependence of Ron,sp in silicon carbide and GaAs Schottky diode. 於 2002 IEEE International Reliability Physics Symposium Proceedings, IRPS 2002 - 40th Annual (卷 2002-January, 頁 425-426). [996678] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RELPHY.2002.996678
Luo, Ji ; Chung, Kuan Jung ; Hu, Huang ; Bernstein, J. B. / Temperature dependence of Ron,sp in silicon carbide and GaAs Schottky diode. 2002 IEEE International Reliability Physics Symposium Proceedings, IRPS 2002 - 40th Annual. 卷 2002-January Institute of Electrical and Electronics Engineers Inc., 2002. 頁 425-426
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Luo, J, Chung, KJ, Hu, H & Bernstein, JB 2002, Temperature dependence of Ron,sp in silicon carbide and GaAs Schottky diode. 於 2002 IEEE International Reliability Physics Symposium Proceedings, IRPS 2002 - 40th Annual. 卷 2002-January, 996678, Institute of Electrical and Electronics Engineers Inc., 頁 425-426, 40th Annual IEEE International Reliability Physics Symposium, IRPS 2002, Dallas, United States, 02-04-07. https://doi.org/10.1109/RELPHY.2002.996678

Temperature dependence of Ron,sp in silicon carbide and GaAs Schottky diode. / Luo, Ji; Chung, Kuan Jung; Hu, Huang; Bernstein, J. B.

2002 IEEE International Reliability Physics Symposium Proceedings, IRPS 2002 - 40th Annual. 卷 2002-January Institute of Electrical and Electronics Engineers Inc., 2002. p. 425-426 996678.

研究成果: Conference contribution

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Luo J, Chung KJ, Hu H, Bernstein JB. Temperature dependence of Ron,sp in silicon carbide and GaAs Schottky diode. 於 2002 IEEE International Reliability Physics Symposium Proceedings, IRPS 2002 - 40th Annual. 卷 2002-January. Institute of Electrical and Electronics Engineers Inc. 2002. p. 425-426. 996678 https://doi.org/10.1109/RELPHY.2002.996678