Surface morphology measurement and investigation of a new CMOS compatible thermopile with high fill factor

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

A new CMOS compatible thermopile was designed and fabricated with high fill factor, the floating membrane of the thermopile which we designed was formed by T-shape anisotropic etching window that never be proposed before. The design and fabrication of thermopile sensors are realized by using 1.2 μm CMOSIC technology combined with a subsequent anisotropic frontside etching. Four etching windows with minimum T-shape were opened by the CMOS processes, and then by using N2H4 etching solution the silicon substrate was etched along <100> directions. The T-shape etching windows which proposed in this paper are designed at four quadrant of membrane to form the extended undercut etching area of opened windows of overlap. The floating membrane has a larger area of 1100×1100μm2 and 2 μm thick. Therefore, the area of proposed membrane Ls increased greatly which absorbs more infrared radiation than the conventional design and enhances responsivity very well. A surface morphology measurement of thermopile is implemented to evaluate the influence of residual stress and characterize geometric shape of membrane practically. More careful analysis of surface morphology show the bending of suspension parts has a deviation of responsivity less than 0.167%. For our work, the T-shape structure of thermopile with large absorption area and high performance by using CMOS compatible process is proven to be very successful and easy fabricated.

原文English
主出版物標題IMTC'06 - Proceedings of the IEEE Instrumentation and Measurement Technology Conference
頁面2032-2037
頁數6
DOIs
出版狀態Published - 2006 十二月 1
事件IMTC'06 - IEEE Instrumentation and Measurement Technology Conference - Sorrento, Italy
持續時間: 2006 四月 242006 四月 27

出版系列

名字Conference Record - IEEE Instrumentation and Measurement Technology Conference
ISSN(列印)1091-5281

Other

OtherIMTC'06 - IEEE Instrumentation and Measurement Technology Conference
國家Italy
城市Sorrento
期間06-04-2406-04-27

    指紋

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

引用此

Chen, S. J., & Shen, C. H. (2006). Surface morphology measurement and investigation of a new CMOS compatible thermopile with high fill factor. 於 IMTC'06 - Proceedings of the IEEE Instrumentation and Measurement Technology Conference (頁 2032-2037). [1700550] (Conference Record - IEEE Instrumentation and Measurement Technology Conference). https://doi.org/10.1109/IMTC.2006.236404