摘要
The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction between transmitted and received signals, and nearby circuits appear to be manageable. This technology can potentially be applied for implementation of a true single-chip radio for general purpose communication, on-chip and inter-chip data communication systems, RFID tags, RF sensors/radars, and others.
原文 | English |
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頁(從 - 到) | 1312-1323 |
頁數 | 12 |
期刊 | IEEE Transactions on Electron Devices |
卷 | 52 |
發行號 | 7 |
DOIs | |
出版狀態 | Published - 2005 七月 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering