Numerical simulation and experimental study on bonding tool design of thermosonic transducer for Flip-Chip bonding

Yi Cheng Huang, Kun Yang Li

研究成果: Conference contribution

摘要

In this paper, the study for the bonding tool position of ultrasonic transducers for thermosonic Flip-Chip LED bonding is presented. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. To obtain the actual movement of ultrasonic transducer, finite element method ATILA was employed to get more detailed information. To verify the reliability of simulation results, the impedance characteristic and resonance frequency of the transducer mechanical system have been measured using a LCR meter. Moreover, different mounting position of bonding tool on the transducer was studied. Use ATILA to find the best tool position, and vibration amplitude of the tool was measured by Laser Doppeler Vibrometer. Experimental bonding results are verified by in-house shear force test bed.

原文English
主出版物標題Mechatronics and Applied Mechanics
頁面1670-1673
頁數4
DOIs
出版狀態Published - 2012
事件Mechatronics and Applied Mechanics - Hong Kong, Hong Kong
持續時間: 2011 十二月 272011 十二月 28

出版系列

名字Applied Mechanics and Materials
157-158
ISSN(列印)1660-9336
ISSN(電子)1662-7482

Other

OtherMechatronics and Applied Mechanics
國家Hong Kong
城市Hong Kong
期間11-12-2711-12-28

All Science Journal Classification (ASJC) codes

  • Engineering(all)

指紋 深入研究「Numerical simulation and experimental study on bonding tool design of thermosonic transducer for Flip-Chip bonding」主題。共同形成了獨特的指紋。

引用此