TY - GEN
T1 - Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method
AU - Lin, Ming Tzer
AU - Tong, Chi Jia
AU - Cheng, Ya Chi
AU - Chung, Kuan-Jung
AU - Hsu, Jiong Shiun
PY - 2009/9/23
Y1 - 2009/9/23
N2 - A paddle-like cantilever beam was designed and developed as a specimen to measure the mechanical behavior of thin films. This beam is in triangle shape in order to provide uniform plane strain distribution and standard clean room processing was used to prepare the sample. The residual stress measurement of thin films application for MEMS were studied with the deflections of silver, gold, and copper films (50-250 nm) driven by the electrostatic force and measured using four step phase-shifting method. The results present that the test structure and the optical (FSPS) method work excellently. Furthermore, silver presents that the deflection decreases after deposition to demonstrate that the tensile residual stress in the film. Oppositely, gold and copper films show compressive residual stress in them.
AB - A paddle-like cantilever beam was designed and developed as a specimen to measure the mechanical behavior of thin films. This beam is in triangle shape in order to provide uniform plane strain distribution and standard clean room processing was used to prepare the sample. The residual stress measurement of thin films application for MEMS were studied with the deflections of silver, gold, and copper films (50-250 nm) driven by the electrostatic force and measured using four step phase-shifting method. The results present that the test structure and the optical (FSPS) method work excellently. Furthermore, silver presents that the deflection decreases after deposition to demonstrate that the tensile residual stress in the film. Oppositely, gold and copper films show compressive residual stress in them.
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M3 - Conference contribution
AN - SCOPUS:70349216824
SN - 9782355000096
T3 - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
SP - 140
EP - 144
BT - 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009
T2 - 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009
Y2 - 1 April 2009 through 3 April 2009
ER -