Life cycle design through modularity and disassembly

Hwai En Tseng; Shu-Hsuan Chang

doi:10.1109/IS3C.2016.197

Life cycle design through modularity and disassembly

Hwai En Tseng, Shu-Hsuan Chang

工業教育與技術學系

研究成果: Conference contribution

2 引文斯高帕斯（Scopus）

摘要

The fierce market competition result in the increasingly shorter product life cycles. It is a commonly known as a trend of green life cycle engineering design to consider the lightest harm to the environment in the early design stage. In this study, the author attempted to establish an integrated assessment method for modular design and disassembly plan. In this study, the lamp and printer are used as examples to verify the method proposed in this study.

原文	English
主出版物標題	Proceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016
發行者	Institute of Electrical and Electronics Engineers Inc.
頁面	772-775
頁數	4
ISBN（電子）	9781509030712
DOIs	https://doi.org/10.1109/IS3C.2016.197
出版狀態	Published - 2016 八月 16
事件	2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016 - Xi'an, China 持續時間: 2016 七月 4 → 2016 七月 6

Other

Other	2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016
國家	China
城市	Xi'an
期間	16-07-04 → 16-07-06

All Science Journal Classification (ASJC) codes

Signal Processing
Computer Networks and Communications
Computer Science Applications
Energy Engineering and Power Technology
Control and Systems Engineering
Control and Optimization

存取文件

10.1109/IS3C.2016.197

指紋深入研究「Life cycle design through modularity and disassembly」主題。共同形成了獨特的指紋。

引用此

@inproceedings{401f7c720ac5430186752425ae5ab814,

title = "Life cycle design through modularity and disassembly",

abstract = "The fierce market competition result in the increasingly shorter product life cycles. It is a commonly known as a trend of green life cycle engineering design to consider the lightest harm to the environment in the early design stage. In this study, the author attempted to establish an integrated assessment method for modular design and disassembly plan. In this study, the lamp and printer are used as examples to verify the method proposed in this study.",

author = "Tseng, {Hwai En} and Shu-Hsuan Chang",

year = "2016",

month = aug,

day = "16",

doi = "10.1109/IS3C.2016.197",

language = "English",

pages = "772--775",

booktitle = "Proceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

address = "United States",

note = "2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016 ; Conference date: 04-07-2016 Through 06-07-2016",

}

Tseng, HE & Chang, S-H 2016, Life cycle design through modularity and disassembly. 於 Proceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016., 7545307, Institute of Electrical and Electronics Engineers Inc., 頁 772-775, 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016, Xi'an, China, 16-07-04. https://doi.org/10.1109/IS3C.2016.197

TY - GEN

T1 - Life cycle design through modularity and disassembly

AU - Tseng, Hwai En

AU - Chang, Shu-Hsuan

PY - 2016/8/16

Y1 - 2016/8/16

N2 - The fierce market competition result in the increasingly shorter product life cycles. It is a commonly known as a trend of green life cycle engineering design to consider the lightest harm to the environment in the early design stage. In this study, the author attempted to establish an integrated assessment method for modular design and disassembly plan. In this study, the lamp and printer are used as examples to verify the method proposed in this study.

AB - The fierce market competition result in the increasingly shorter product life cycles. It is a commonly known as a trend of green life cycle engineering design to consider the lightest harm to the environment in the early design stage. In this study, the author attempted to establish an integrated assessment method for modular design and disassembly plan. In this study, the lamp and printer are used as examples to verify the method proposed in this study.

UR - http://www.scopus.com/inward/record.url?scp=84986193762&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84986193762&partnerID=8YFLogxK

U2 - 10.1109/IS3C.2016.197

DO - 10.1109/IS3C.2016.197

M3 - Conference contribution

AN - SCOPUS:84986193762

SP - 772

EP - 775

BT - Proceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016

Y2 - 4 July 2016 through 6 July 2016

ER -