Life cycle design through modularity and disassembly

Hwai En Tseng, Shu-Hsuan Chang

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

The fierce market competition result in the increasingly shorter product life cycles. It is a commonly known as a trend of green life cycle engineering design to consider the lightest harm to the environment in the early design stage. In this study, the author attempted to establish an integrated assessment method for modular design and disassembly plan. In this study, the lamp and printer are used as examples to verify the method proposed in this study.

原文English
主出版物標題Proceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016
發行者Institute of Electrical and Electronics Engineers Inc.
頁面772-775
頁數4
ISBN(電子)9781509030712
DOIs
出版狀態Published - 2016 八月 16
事件2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016 - Xi'an, China
持續時間: 2016 七月 42016 七月 6

Other

Other2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016
國家China
城市Xi'an
期間16-07-0416-07-06

All Science Journal Classification (ASJC) codes

  • Signal Processing
  • Computer Networks and Communications
  • Computer Science Applications
  • Energy Engineering and Power Technology
  • Control and Systems Engineering
  • Control and Optimization

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