Investigation on Optimization of Baking in Sole Bonding Process

Dyi Cheng Chen, Hua Wei Jin, Jhang Zong Su

研究成果: Conference article

摘要

Nowadays, Taiwan's footwear industry has become more computerized and automated, but there are still places in the manufacturing process that can be optimized. In the general shoe bonding process, baking requires very high power and a long time. This Investigation used Solidworks to build a common shoe model, and used Solidworks simulation and other CAE software to discuss the baking soles and achieve the soles. The heat required for t optimize the parameters he temperature of the work is bonded, and through the TRIZ theory to optimize the parameters such as power and time required for the baking process, it can be heated by asymmetric heating to obtain a surface with relatively uniform heating to obtain a solution that effectively reduces the production cost in the process. It is found that when the heating source is separated by 40 mm, a surface with relatively uniform heat can be obtained.

原文English
文章編號012002
期刊IOP Conference Series: Materials Science and Engineering
644
發行號1
DOIs
出版狀態Published - 2019 十月 24
事件4th International Conference on Precision Machinery and Manufacturing Technology, ICPMMT 2019 - Kenting, Taiwan
持續時間: 2019 五月 242019 五月 26

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

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