Inter-chip wireless communication

Hsin Ta Wu, Jau Jr Lin, K. O. Kenneth

研究成果: Conference contribution

6 引文 斯高帕斯(Scopus)

摘要

The wireless channel characteristics for inter-chip communication at 15-24-GHz in a hybrid engine controller printed circuit board (PCB) with and without a metal cover are presented. The channels are characterized using a 3-mm on-chip dipole antenna pair. At 15-cm separation, by adding a metal cover ∼3.5 cm above the PCB, the antenna pair gain can be improved by ∼10 dB and the maximum excess delay can be reduced to ∼1.1 ns from ∼16.5 ns. A bond wire antenna has efficiency of ∼15% at ∼60 GHz and is sufficient for building a 1-Gbps radio link with a bit error rate of 10-12 between chips separated by 10cm.

原文English
主出版物標題2013 7th European Conference on Antennas and Propagation, EuCAP 2013
頁面3647-3649
頁數3
出版狀態Published - 2013 八月 14
事件2013 7th European Conference on Antennas and Propagation, EuCAP 2013 - Gothenburg, Sweden
持續時間: 2013 四月 82013 四月 12

出版系列

名字2013 7th European Conference on Antennas and Propagation, EuCAP 2013

Other

Other2013 7th European Conference on Antennas and Propagation, EuCAP 2013
國家Sweden
城市Gothenburg
期間13-04-0813-04-12

    指紋

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications

引用此

Wu, H. T., Lin, J. J., & Kenneth, K. O. (2013). Inter-chip wireless communication. 於 2013 7th European Conference on Antennas and Propagation, EuCAP 2013 (頁 3647-3649). [6546991] (2013 7th European Conference on Antennas and Propagation, EuCAP 2013).