Improvement of thermal growth compensation for motorized spindles

Kun Fang Huang, Yu Ling Juan, Chia Hui Tang, Ching Feng Chang, Tsair Rong Chen

研究成果: Conference contribution

摘要

A dual displacement measurement meter applied as a compensatory device for spindle thermal growth compensation , it can reduce the measurement error dramatically from single measurement device. The result matches the laser inspection report, which is an external direct checking device and been considered as one of the best checking device of spindle thermal growth. However, the non-flat surface of spindle nose, fluctuating measurement distance and the tiny measurement meter can hardly be fitted rectangular to spindle nose surface which create a certain percentage of error when the single displacement measurement meter is applied. The addition of a differential amplifier will greatly enhance the linear output voltage fed back from dual measurement meter to the CPU and provide a high sensitive level of compensation. This new device can reduce the measurement error from 6% down to 1.8%. The machining tolerance can be improved greatly and machining time is reduced. The quality of the machine and the cutting performance can be upgraded.

原文English
主出版物標題IEEM2010 - IEEE International Conference on Industrial Engineering and Engineering Management
頁面2403-2410
頁數8
DOIs
出版狀態Published - 2010 十二月 1
事件IEEE International Conference on Industrial Engineering and Engineering Management, IEEM2010 - Macao, China
持續時間: 2010 十二月 72010 十二月 10

出版系列

名字IEEM2010 - IEEE International Conference on Industrial Engineering and Engineering Management

Other

OtherIEEE International Conference on Industrial Engineering and Engineering Management, IEEM2010
國家China
城市Macao
期間10-12-0710-12-10

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering

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