Glass ball grid array arrangement and characterization for capacitive proximity sensor

Chun Yi Chu, Kerwin Wang

研究成果: Conference contribution

摘要

In this paper, we proposed a novel capacitive sensor. It was constituted by the parallel enameled copper wires as the electrodes. This sensor can be used to detect the yield ratio of micro assembled glass ball grid array (GBGA). The vacancy of the GBGA causes the capacitance drop, so we can detect the yield ratio of the micro-assembly process of GBGA by monitoring the change of the capacitance. Additionally, we measured the capacitance variation of the relative displacement about the copper wires and the GBGA in longitudinal and transverse directions. The measurements of capacitance variation in longitudinal relative displacement have stepwise features. These features have not been seen in other capacitive proximity sensors.

原文English
主出版物標題Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering
主出版物子標題Information and Innovation for Modern Technology, ICICE 2017
編輯Artde Donald Kin-Tak Lam, Stephen D. Prior, Teen-Hang Meen
發行者Institute of Electrical and Electronics Engineers Inc.
頁面498-501
頁數4
ISBN(電子)9781538632024
DOIs
出版狀態Published - 2018 十月 1
事件2017 IEEE International Conference on Information, Communication and Engineering, ICICE 2017 - Xiamen, Fujian, China
持續時間: 2017 十一月 172017 十一月 20

出版系列

名字Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017

Other

Other2017 IEEE International Conference on Information, Communication and Engineering, ICICE 2017
國家China
城市Xiamen, Fujian
期間17-11-1717-11-20

指紋

Proximity sensors
Capacitive sensors
Ball grid arrays
Capacitance
Glass
Wire
Copper
Vacancies
Electrodes
Grid
Proximity
Sensor
Monitoring
Sensors

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Hardware and Architecture
  • Information Systems and Management

引用此文

Chu, C. Y., & Wang, K. (2018). Glass ball grid array arrangement and characterization for capacitive proximity sensor. 於 A. D. K-T. Lam, S. D. Prior, & T-H. Meen (編輯), Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017 (頁 498-501). [8478878] (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICICE.2017.8478878
Chu, Chun Yi ; Wang, Kerwin. / Glass ball grid array arrangement and characterization for capacitive proximity sensor. Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. 編輯 / Artde Donald Kin-Tak Lam ; Stephen D. Prior ; Teen-Hang Meen. Institute of Electrical and Electronics Engineers Inc., 2018. 頁 498-501 (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017).
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abstract = "In this paper, we proposed a novel capacitive sensor. It was constituted by the parallel enameled copper wires as the electrodes. This sensor can be used to detect the yield ratio of micro assembled glass ball grid array (GBGA). The vacancy of the GBGA causes the capacitance drop, so we can detect the yield ratio of the micro-assembly process of GBGA by monitoring the change of the capacitance. Additionally, we measured the capacitance variation of the relative displacement about the copper wires and the GBGA in longitudinal and transverse directions. The measurements of capacitance variation in longitudinal relative displacement have stepwise features. These features have not been seen in other capacitive proximity sensors.",
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Chu, CY & Wang, K 2018, Glass ball grid array arrangement and characterization for capacitive proximity sensor. 於 ADK-T Lam, SD Prior & T-H Meen (編輯), Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017., 8478878, Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017, Institute of Electrical and Electronics Engineers Inc., 頁 498-501, 2017 IEEE International Conference on Information, Communication and Engineering, ICICE 2017, Xiamen, Fujian, China, 17-11-17. https://doi.org/10.1109/ICICE.2017.8478878

Glass ball grid array arrangement and characterization for capacitive proximity sensor. / Chu, Chun Yi; Wang, Kerwin.

Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. 編輯 / Artde Donald Kin-Tak Lam; Stephen D. Prior; Teen-Hang Meen. Institute of Electrical and Electronics Engineers Inc., 2018. p. 498-501 8478878 (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017).

研究成果: Conference contribution

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AB - In this paper, we proposed a novel capacitive sensor. It was constituted by the parallel enameled copper wires as the electrodes. This sensor can be used to detect the yield ratio of micro assembled glass ball grid array (GBGA). The vacancy of the GBGA causes the capacitance drop, so we can detect the yield ratio of the micro-assembly process of GBGA by monitoring the change of the capacitance. Additionally, we measured the capacitance variation of the relative displacement about the copper wires and the GBGA in longitudinal and transverse directions. The measurements of capacitance variation in longitudinal relative displacement have stepwise features. These features have not been seen in other capacitive proximity sensors.

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Chu CY, Wang K. Glass ball grid array arrangement and characterization for capacitive proximity sensor. 於 Lam ADK-T, Prior SD, Meen T-H, 編輯, Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 498-501. 8478878. (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017). https://doi.org/10.1109/ICICE.2017.8478878