TY - GEN
T1 - Finite element analysis and die design of extrusion processes of radial-finned heat sink
AU - Chen, Dyi Cheng
AU - Chen, Jhih Ming
AU - Guo, Ming Wei
AU - Jao, Chih Hsuan
AU - Chen, Wen Jong
N1 - Copyright:
Copyright 2011 Elsevier B.V., All rights reserved.
PY - 2011
Y1 - 2011
N2 - There are many different types of manufacturing methods for heat sink fins in the current market. The aim of this study is to design an extrusion die for a radial-finned heat sink using a commercial finite element package, DEFORMTM 3D. We then conduct a series of simulation analyses with different variables such as friction factor, ram velocity, and fin gate stage of the die to evaluate the methods of decreasing the warping in the extrusion process. The die is assumed as a rigid body in the analyses. The results confirm the suitability of DEFORMTM 3D to design an extrusion die achieving a lower warping behavior of the radial-finned heat sink.
AB - There are many different types of manufacturing methods for heat sink fins in the current market. The aim of this study is to design an extrusion die for a radial-finned heat sink using a commercial finite element package, DEFORMTM 3D. We then conduct a series of simulation analyses with different variables such as friction factor, ram velocity, and fin gate stage of the die to evaluate the methods of decreasing the warping in the extrusion process. The die is assumed as a rigid body in the analyses. The results confirm the suitability of DEFORMTM 3D to design an extrusion die achieving a lower warping behavior of the radial-finned heat sink.
UR - http://www.scopus.com/inward/record.url?scp=79961061733&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79961061733&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.264-265.30
DO - 10.4028/www.scientific.net/AMR.264-265.30
M3 - Conference contribution
AN - SCOPUS:79961061733
SN - 9783037850534
T3 - Advanced Materials Research
SP - 30
EP - 35
BT - Advances in Materials and Processing Technologies II, AMPT 2009
T2 - International Conference on Advances in Materials and Processing Technologies, AMPT 2009
Y2 - 26 October 2009 through 29 October 2009
ER -