Filling through-silicon vias with conductive ferromagnetic silver-iron composite

Chung Han Lu, Kerwin Wang

研究成果: Conference contribution

摘要

This paper demonstrates a novel magnetic induced injection method of ferromagnetic composite to build electrically conductive through-silicon vias (TSVs). The through conductive via is filled with conductive ferromagnetic composite by attractive magnetic force. The composite is made of the mixture of silver and iron nanoparticles. SU-8 2002 is covered on the side walls of via as an insulating material by a low vacuum suction. After thermal curing process, the dielectric layer can possess an electric field as high as 5×106 V/cm. All of the fabrication steps are completed below 100 C. The TSVs can allow a current density of 6×107 A/m2. The leakage current is 2×10-6 A at 50 V. After DC electrical sintering, the resistances of each TSV is less than 0.85 Ω.

原文English
主出版物標題9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
發行者Institute of Electrical and Electronics Engineers Inc.
頁面366-369
頁數4
ISBN(電子)9781479947270
DOIs
出版狀態Published - 2014 九月 23
事件9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 - Waikiki Beach, United States
持續時間: 2014 四月 132014 四月 16

出版系列

名字9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014

Other

Other9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
國家United States
城市Waikiki Beach
期間14-04-1314-04-16

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

指紋 深入研究「Filling through-silicon vias with conductive ferromagnetic silver-iron composite」主題。共同形成了獨特的指紋。

  • 引用此

    Lu, C. H., & Wang, K. (2014). Filling through-silicon vias with conductive ferromagnetic silver-iron composite. 於 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 (頁 366-369). [6908828] (9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2014.6908828