Feature extraction of the wafer probe marks in IC packaging

Cheng Yu Tsai, Chia Te Lin, Chen Ting Kao, Chau Shing Wang

研究成果: Conference contribution

指紋 深入研究「Feature extraction of the wafer probe marks in IC packaging」主題。共同形成了獨特的指紋。

Mathematics

Physics & Astronomy

Chemical Compounds

Engineering & Materials Science