Feature extraction of the wafer probe marks in IC packaging

Cheng Yu Tsai, Chia Te Lin, Chen Ting Kao, Chau Shing Wang

研究成果: Conference contribution

摘要

This paper presents an image processing approach to extract six features of the probe mark on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. In this paper, we present a method to extract six features of the wafer probe marks in IC packaging for further digital image processing.

原文English
主出版物標題2017 International Conference on Robotics and Machine Vision
編輯Genci Capi, Chiharu Ishii, Jianhong Zhou
發行者SPIE
ISBN(電子)9781510617308
DOIs
出版狀態Published - 2017 一月 1
事件2017 2nd International Conference on Robotics and Machine Vision, ICRMV 2017 - Kitakyushu, Japan
持續時間: 2017 九月 152017 九月 18

出版系列

名字Proceedings of SPIE - The International Society for Optical Engineering
10613
ISSN(列印)0277-786X
ISSN(電子)1996-756X

Other

Other2017 2nd International Conference on Robotics and Machine Vision, ICRMV 2017
國家Japan
城市Kitakyushu
期間17-09-1517-09-18

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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