Experiment study on bonding tool of thermosonic transducer for flip-chip bonding

Yi-Cheng Huang, Run Yang Li, Chi Hui Chen

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

The thermosonic bonding parameters on LEDs involve different bonding temperatures, different bonding force, different bonding time and different ultrasonic power. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. However, the place of the tool on the transducer has affected transducer work efficiency. Therefore, to analyse the transducer and tool provided reliable experimental basis by using the commercial package GID & ATILA software. Finding the resonance frequency of the transducer was measured with LCR HiTESTER. By using laser metrology measurement, the real displacement was measured. Finding the results of the optimization promoted the parameter combination of less force and lower bonding temperature. Using a simple thrust machine created the shearing force for bonding force investigation. Experiment results considering temperature, pressure, ultrasonic power and ultrasonic time are conducted using the Taguchi method for optimization. Experimental results illustrated the optimization are reached a promising aim for the flip-chip LED in thermosonic bonding manufacturing.

原文English
主出版物標題Proceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008
頁面1002-1007
頁數6
DOIs
出版狀態Published - 2008 九月 30
事件2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008 - Xi'an, China
持續時間: 2008 八月 22008 八月 5

出版系列

名字IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM

Other

Other2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008
國家China
城市Xi'an
期間08-08-0208-08-05

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Software
  • Computer Science Applications
  • Electrical and Electronic Engineering

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  • 引用此

    Huang, Y-C., Li, R. Y., & Chen, C. H. (2008). Experiment study on bonding tool of thermosonic transducer for flip-chip bonding. 於 Proceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008 (頁 1002-1007). [4601798] (IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM). https://doi.org/10.1109/AIM.2008.4601798