Electrical performance of micro-assembled beads under different temperatures and loadings

Yen Lin Tzeng, Kerwin Wang

研究成果: Conference contribution

摘要

Micro-assembly is an efficient tool to build electrical connections with metallic micro-beads. This process uses patterned photoresist AZ1512 as an adhesion for micro-bead arrangement. The assembled beads is immobilized with underfill embedment (ZYMET 2821). This method allows arbitrary geometric pattern designs. All of these processes can be completed below 150°C. This paper characterizes the electrical performance of these densely-arranged anisotropic conductive tunnels under different temperatures and stresses loading Experiment results suggest that using photoresist to assemble micro conductive beads with underfill immobilization can yield stable performance.

原文English
主出版物標題2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
頁面433-436
頁數4
DOIs
出版狀態Published - 2012 六月 1
事件7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan
持續時間: 2012 三月 52012 三月 8

出版系列

名字2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

Other

Other7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
國家Japan
城市Kyoto
期間12-03-0512-03-08

All Science Journal Classification (ASJC) codes

  • Engineering (miscellaneous)

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  • 引用此

    Tzeng, Y. L., & Wang, K. (2012). Electrical performance of micro-assembled beads under different temperatures and loadings. 於 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 (頁 433-436). [6196811] (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012). https://doi.org/10.1109/NEMS.2012.6196811