Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme

研究成果: Conference contribution

摘要

Using traditional methods such as perturbation theory or Galerkin approach method to analyze the dynamic response of electrostatic devices is not easy due to the complexity of the interactions between the electrostatic coupling effect, the fringing field effect, the residual stress, the nonlinear electrostatic force and squeeze-film damping effect. Accordingly, the present study proposes a new approach for analyzing the dynamic response of such devices using a hybrid numerical scheme comprising the differential transformation method and the finite difference method by pure DC or combined DC / AC loading. The validity of the proposed scheme is confirmed by comparing the results obtained for the pull-in voltage of the micro-beam with those presented in the literature derived using a variety of schemes. Overall, the results show that the hybrid numerical scheme provides a suitable means of analyzing the nonlinear dynamic behavior of a wide variety of common electrostatically-actuated microstructures.

原文English
主出版物標題Modern Materials and Technologies of Industrial Production
頁面474-477
頁數4
DOIs
出版狀態Published - 2013 十一月 4
事件2nd International Conference on Mechanical Properties of Materials and Information Technology, ICMPMIT 2013 - , Hong Kong
持續時間: 2013 八月 172013 八月 19

出版系列

名字Advanced Materials Research
811
ISSN(列印)1022-6680

Other

Other2nd International Conference on Mechanical Properties of Materials and Information Technology, ICMPMIT 2013
國家Hong Kong
期間13-08-1713-08-19

    指紋

All Science Journal Classification (ASJC) codes

  • Engineering(all)

引用此

Liu, C-C. (2013). Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme. 於 Modern Materials and Technologies of Industrial Production (頁 474-477). (Advanced Materials Research; 卷 811). https://doi.org/10.4028/www.scientific.net/AMR.811.474