Die-bonding study for double-channel ridge waveguide AlGaInP laser diodes

Zhen Wu Yang, Man Fang Huang, Jung Tsung Hsu, Chau Chong Kuo, Chien Chia Chiu, Chiu Ling Chen, Meng Chyi Wu

研究成果: Conference article同行評審

摘要

The double-channel ridge waveguide (DCRW) laser diode is investigated to determine its die-bonding conditions and thermal dissipation capability. Two different bonding facilities are employed when doing die-bonding to verify if pre-vacuumed environment is helpful for good die-bonding. Scanning electron microscopy is used to determine the condition of the interface between laser diode and heatsink. From the measured group behavior of thermal resistance, it is noted that poor die bonding lead to rapid increase in thermal resistance and ineffective heat dissipation occur when heat is transported to heat sinks.

原文English
頁(從 - 到)98-105
頁數8
期刊Proceedings of SPIE - The International Society for Optical Engineering
3626
DOIs
出版狀態Published - 1999
事件Proceedings of the 1999 Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV - San Jose, CA, USA
持續時間: 1999 一月 281999 一月 28

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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