Deterministic three-dimensional micro-assembly in parallel

Huo Chuan Lin, Chia Chung Wang, Kerwin Wang

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

This paper introduces a novel deterministic three-dimensional micro-assembly method to tackle the difficulty of micro-part assembling at unstable equilibrium region. We design, characterize and manufacture an parallel assembly system, which is capable of connecting micro-parts from almost arbitrary direction into desired structures in batch processes. This paper also introduces a non-contact method to measurement the surface adhesion forces among parts, donor and receiver substrates. Five successive 3D micro-assembly processes have be tested with yield ratio investigation to demonstrate this technology. Table 1. A comparison of this study to some published three-dimensional assembly technologies

原文English
主出版物標題NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
頁面1128-1131
頁數4
DOIs
出版狀態Published - 2011 十月 4
事件6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011 - Kaohsiung, Taiwan
持續時間: 2011 二月 202011 二月 23

Other

Other6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011
國家Taiwan
城市Kaohsiung
期間11-02-2011-02-23

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics

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