Design optimization of laser-induced microbridges for low resistance interline connections in ICs

Kuan Jung Chung, Martin Peckerar, Joseph B. Bernstein

研究成果: Article

1 引文 斯高帕斯(Scopus)

摘要

In this work, we present a two-dimensional finite element (FE) model for laser beam-induced low-resistance lateral interconnects. We refer to these links as "Microbridges". The model allowed designers using different geometric parameters (interline spacing and the width-to-height ratio of metal lines) and metal-dielectric combination (Al/SiO2) to optimize the design structure. The results of the FE analysis are consistent with the experimental results. An optimal design diagram for the Al/SiO2 system is created to provide the best dimensional combinations exhibiting the widest process window and the best production yield.

原文English
頁(從 - 到)70-75
頁數6
期刊Microelectronic Engineering
103
DOIs
出版狀態Published - 2013 三月

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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