Characteristics of System in a Package of Synchronous Dynamic Random Access Memory for High-Speed Data Storage Applications

Yeong Lin Lai, Wen Jung Chiang

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

This paper proposes a system in a package (SiP) integrating a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) for advanced data-storage-based systems. The characteristics of high frequency, signal integrity (SI), and power integrity (PI) were investigated for the SoC/DDR3-SDRAM SiP. The SiP exhibited low insertion loss, wide eye-diagram aperture, and low power impedance. The effect of de-coupling capacitors on the SiP was also examined. The SoC/DDR3-SDRAM SiP achieved excellent performance for high-speed data storage applications.

原文English
文章編號6851288
期刊IEEE Transactions on Magnetics
50
發行號7
DOIs
出版狀態Published - 2014 七月 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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