Characteristics of a system in a package with silver wires

Yeong Lin Lai, Wen Jung Chiang

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

This study examined the high-speed characteristics of a system in a package (SiP) including a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) chip. The SiP was a multi-chip-module thin-profile fine-pitch ball grid array (MCM TFBGA) package with a four-layer substrate. High-speed DDR3 signals with a 1600-Mbps data rate were used in the signal integrity (SI) analysis. The SiP with low-cost silver (Ag) wires displayed a 500.18-ps aperture width in an eye diagram, which successfully met the SI performance requirement. This study thus demonstrated that the SiP with Ag wires would have significant potential for advanced high-speed product applications.

原文English
主出版物標題Materials and Technologies in Precision Machinery
編輯Gow-Yi Tzou
發行者Trans Tech Publications Ltd
頁面121-127
頁數7
ISBN(列印)9783038355731
DOIs
出版狀態Published - 2015 一月 1
事件1st International Conference on Precision Machinery and Manufacturing Technology, ICPMMT 2015 - Pingtung, Taiwan
持續時間: 2015 五月 222015 五月 24

出版系列

名字Key Engineering Materials
661
ISSN(列印)1013-9826

Other

Other1st International Conference on Precision Machinery and Manufacturing Technology, ICPMMT 2015
國家Taiwan
城市Pingtung
期間15-05-2215-05-24

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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