Characteristics of a system in a package with silver wires

Yeong Lin Lai; Wen Jung Chiang

doi:10.4028/www.scientific.net/KEM.661.121

Characteristics of a system in a package with silver wires

Yeong Lin Lai, Wen Jung Chiang

機電工程學系

研究成果: Conference contribution

2 引文斯高帕斯（Scopus）

摘要

This study examined the high-speed characteristics of a system in a package (SiP) including a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) chip. The SiP was a multi-chip-module thin-profile fine-pitch ball grid array (MCM TFBGA) package with a four-layer substrate. High-speed DDR3 signals with a 1600-Mbps data rate were used in the signal integrity (SI) analysis. The SiP with low-cost silver (Ag) wires displayed a 500.18-ps aperture width in an eye diagram, which successfully met the SI performance requirement. This study thus demonstrated that the SiP with Ag wires would have significant potential for advanced high-speed product applications.

原文	English
主出版物標題	Materials and Technologies in Precision Machinery
編輯	Gow-Yi Tzou
發行者	Trans Tech Publications Ltd
頁面	121-127
頁數	7
ISBN（列印）	9783038355731
DOIs	https://doi.org/10.4028/www.scientific.net/KEM.661.121
出版狀態	Published - 2015 一月 1
事件	1st International Conference on Precision Machinery and Manufacturing Technology, ICPMMT 2015 - Pingtung, Taiwan 持續時間: 2015 五月 22 → 2015 五月 24

出版系列

名字	Key Engineering Materials
卷	661
ISSN（列印）	1013-9826

Other

Other	1st International Conference on Precision Machinery and Manufacturing Technology, ICPMMT 2015
國家	Taiwan
城市	Pingtung
期間	15-05-22 → 15-05-24

All Science Journal Classification (ASJC) codes

Materials Science(all)
Mechanics of Materials
Mechanical Engineering

存取文件

10.4028/www.scientific.net/KEM.661.121

指紋深入研究「Characteristics of a system in a package with silver wires」主題。共同形成了獨特的指紋。

引用此

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abstract = "This study examined the high-speed characteristics of a system in a package (SiP) including a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) chip. The SiP was a multi-chip-module thin-profile fine-pitch ball grid array (MCM TFBGA) package with a four-layer substrate. High-speed DDR3 signals with a 1600-Mbps data rate were used in the signal integrity (SI) analysis. The SiP with low-cost silver (Ag) wires displayed a 500.18-ps aperture width in an eye diagram, which successfully met the SI performance requirement. This study thus demonstrated that the SiP with Ag wires would have significant potential for advanced high-speed product applications.",

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Lai, YL & Chiang, WJ 2015, Characteristics of a system in a package with silver wires. 於 G-Y Tzou (編輯), Materials and Technologies in Precision Machinery. Key Engineering Materials, 卷 661, Trans Tech Publications Ltd, 頁 121-127, 1st International Conference on Precision Machinery and Manufacturing Technology, ICPMMT 2015, Pingtung, Taiwan, 15-05-22. https://doi.org/10.4028/www.scientific.net/KEM.661.121

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