Application of image processing to wafer probe mark area calculation

Chau Shing Wang, Wen Ren Yang, Cheng Yen Chung, Wen Liang Chang

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

摘要

This paper presents an image processing approach that calculates the probe mark area on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this paper, we present an imaging processing approach to calculate the probe mark area utilizing high magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to traditional methods.

原文English
主出版物標題Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010
頁面414-419
頁數6
DOIs
出版狀態Published - 2010 九月 1
事件5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010 - Taichung, Taiwan
持續時間: 2010 六月 152010 六月 17

出版系列

名字Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010

Other

Other5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010
國家Taiwan
城市Taichung
期間10-06-1510-06-17

    指紋

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

引用此

Wang, C. S., Yang, W. R., Chung, C. Y., & Chang, W. L. (2010). Application of image processing to wafer probe mark area calculation. 於 Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010 (頁 414-419). [5516928] (Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010). https://doi.org/10.1109/ICIEA.2010.5516928