An improved thermal Type microsensor with thermal Isolation microcracks

研究成果: Conference contribution

摘要

A new idea of improving complementary metal-oxide-semiconductor (CMOS) thermopile performance is introduced to reduce the thermal conductance by leading the microcracks into structure of thermopile, which greatly increases the heat flow barrier. A highly sensitive infrared detector requires a low thermal conductance to maximize the temperature change and signal induced by incident IR radiation. Several designs of infrared microsensors are proposed to study influential parameters from microcrack for improving performance of thermopile. To that end, by using some adequate designs of polysilicon architecture, we can greatly reduce the heat flow from the main stream without introducing further electric resistance, which is related with noise. Firstly we develop such a structure of thermopile with low thermal conductance and high performance by using CMOS compatible process which can be easily and exactly fabricated. The suspended structure of infrared sensors is used in this study to provide ideal, thermally isolated, structures for support of the thin film detector. We also simulate the heat flow of the new structures. The results show good match with our original idea.

原文English
主出版物標題Manufacturing Science and Engineering I
頁面4230-4233
頁數4
DOIs
出版狀態Published - 2010 四月 22
事件2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009 - Zhuhai, China
持續時間: 2009 十二月 262009 十二月 28

出版系列

名字Advanced Materials Research
97-101
ISSN(列印)1022-6680

Other

Other2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009
國家China
城市Zhuhai
期間09-12-2609-12-28

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • 引用此

    Cai, Y. Z., Shen, C. H., & Chen, S. J. (2010). An improved thermal Type microsensor with thermal Isolation microcracks. 於 Manufacturing Science and Engineering I (頁 4230-4233). (Advanced Materials Research; 卷 97-101). https://doi.org/10.4028/www.scientific.net/AMR.97-101.4230