TY - GEN
T1 - A study on the cellphone cover-forming process of titanium alloys using the finite element method
AU - Chen, Dyi Cheng
AU - Chen, Ming Ren
AU - Nian, Fung Ling
N1 - Copyright:
Copyright 2012 Elsevier B.V., All rights reserved.
PY - 2012
Y1 - 2012
N2 - In recent years, the style of 3C products demanded thin and small results due to gradual trends, though most of the industry is forming a continuous manner of stamping. However, the material thickness cannot be changed in products. This paper employs the rigid-plastic finite element (FE) DEFORM TM 3D software to investigate the plastic deformation behavior of titanium alloy (Ti-6Al-4V) workpiece for the forming processes of cellphone covers. In addition, this study utilizes the Solid Work 2010 3D graphics-rendering software for modeling, which is simulation software used to import various forming process conditions. The software analyzes the effective strain, the effective stress, critical damage value, and the die radius load distribution of the work-piece. Furthermore, this study used simulative software to analyze its forming processes for changes in grain size of the microstructure. The analytical results confirm the suitability of the current finite element software for forming processes of cellphone covers.
AB - In recent years, the style of 3C products demanded thin and small results due to gradual trends, though most of the industry is forming a continuous manner of stamping. However, the material thickness cannot be changed in products. This paper employs the rigid-plastic finite element (FE) DEFORM TM 3D software to investigate the plastic deformation behavior of titanium alloy (Ti-6Al-4V) workpiece for the forming processes of cellphone covers. In addition, this study utilizes the Solid Work 2010 3D graphics-rendering software for modeling, which is simulation software used to import various forming process conditions. The software analyzes the effective strain, the effective stress, critical damage value, and the die radius load distribution of the work-piece. Furthermore, this study used simulative software to analyze its forming processes for changes in grain size of the microstructure. The analytical results confirm the suitability of the current finite element software for forming processes of cellphone covers.
UR - http://www.scopus.com/inward/record.url?scp=81255168476&partnerID=8YFLogxK
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U2 - 10.4028/www.scientific.net/AMM.121-126.1550
DO - 10.4028/www.scientific.net/AMM.121-126.1550
M3 - Conference contribution
AN - SCOPUS:81255168476
SN - 9783037852828
T3 - Applied Mechanics and Materials
SP - 1550
EP - 1554
BT - Frontiers of Manufacturing and Design Science II
T2 - 2nd International Conference on Frontiers of Manufacturing and Design Science, ICFMD 2011
Y2 - 11 December 2011 through 13 December 2011
ER -