A study on the bonding conditions and mechanism for glass-to-glass anodic bonding in field emission display

W. T. Yen, Y. C. Lin

研究成果: Article

2 引文 斯高帕斯(Scopus)

摘要

Here we have investigated the bonding conditions and mechanism for glass-to-glass anodic bonding in indium-tin-oxide (ITO)-coated glass using an Al/Cr composite thin film as an interlayer prepared by RF magnetron sputtering. The experimental results show that the bond strength increases with increasing the bonding temperature, bonding voltage, and Al film thickness. The optimum experimental parameters in the anodic bonding were found to be an Al film thickness of 300 nm, bonding temperature of 300°C, and bonding voltage of 700 V. Oxygen content within the bonded interphase increases and aluminum content decreases on increasing both the temperature and voltage during the bonding process. According to EDS analysis results, the main bond mechanism is proposed to be due to the following chemical reactions: 4Na+ + 4e- → 4Na, xAl + yO2- → Al x O y + 6e-, x = 2, y = 3.

原文English
頁(從 - 到)151-162
頁數12
期刊Journal of Adhesion Science and Technology
23
發行號1
DOIs
出版狀態Published - 2009 一月 1

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Mechanics of Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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