A novel method for evaluating the thickness of silicon membrane using a micromachined acoustic wave sensor

Chi Yuan Lee, Ying Chou Cheng, Tsung Tsong Wu, Yung Yu Chen, Wen Jong Chen, Shih Yung Pao, Pei Zen Chang, Ping Hei Chen, Kai Hsiang Yen, Fu Yuan Xiao

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

摘要

This work presents a novel method based on the micromachined acoustic wave sensor for evaluating silicon membrane thickness. Like pressure sensors, accelerometers, micro flow sensors and micropumps, many micro-electro-mechanical systems (MEMS) devices require that silicon membrane thickness be known exactly. Precisely controlling silicon membrane thickness during wet etching is important, because the thickness strongly affects device performance and post-processing. The proposed method for evaluating silicon membrane thickness is novel, simple to implement, and can be monitored in-situ and mass-produced. The spectral analysis of surface waves (SASW), detailed process flows, measurement set-up and the experimental results also are presented.

原文English
頁(從 - 到)61-66
頁數6
期刊Tamkang Journal of Science and Engineering
7
發行號2
出版狀態Published - 2004 六月 1

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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