鍾 官榮

Associate Professor

  • 73 引文
  • 5 h-指數
20012019

每年研究成果

如果您對這些純文本內容做了任何改變,很快就會看到。

指紋 查看啟用 Kuan-Jung Chung 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。

網路 國家層面的近期外部共同作業。通過按一下圓點深入探索詳細資料。

專案

產品可靠度精進專案計畫

Chung, K.

17-10-0118-02-28

研究計畫: Research project

全面品質系統化建置輔導專案計畫

Chung, K.

17-09-1818-12-31

研究計畫: Research project

研究成果

  • 73 引文
  • 5 h-指數
  • 22 Conference contribution
  • 9 Article
  • 1 Conference article
  • 1 Patent

A novel disposable electrochemical sensor packaging with application for the detection of uric acid

Gan, Z. X., Chen, H. S., Lin, Y. C. & Chung, K. J., 2019 一月 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 165-168 4 p. 8625822. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2018-October).

研究成果: Conference contribution

  • 開啟存取
  • 1 引文 斯高帕斯(Scopus)

    The Prediction of Positioning shift for a Robot Arm Using Machine Learning Techniques

    Huang, P. W. & Chung, K. J., 2019 十月, IMPACT 2019 - 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceeding. IEEE Computer Society, p. 58-61 4 p. 9024996. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2019-October).

    研究成果: Conference contribution

  • Prognostic-based reliability assessment of a wafer handling robot arm using Wiener stochastic process model and Monte Carlo simulation

    Huang, J. H., Cheng, H. M., Li, Y. R. & Chung, K. J., 2018 一月 1, Proceedings - 24th ISSAT International Conference on Reliability and Quality in Design. Pham, H. (編輯). International Society of Science and Applied Technologies, p. 1-5 5 p. (Proceedings - 24th ISSAT International Conference on Reliability and Quality in Design).

    研究成果: Conference contribution

  • 1 引文 斯高帕斯(Scopus)

    工具機具殘餘使用壽命預測系統及方法

    Chung, K-J., 2018 十一月 1, 專利號 1639907

    研究成果: Patent