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查看啟用 Kuan-Jung Chung 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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研究成果
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A novel disposable electrochemical sensor packaging with application for the detection of uric acid
Gan, Z. X., Chen, H. S., Lin, Y. C. & Chung, K. J., 2019 一月 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 165-168 4 p. 8625822. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2018-October).研究成果: Conference contribution
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Lifetime prognosis of lithium-ion batteries through novel accelerated degradation measurements and a combined gamma process and Monte Carlo method
Lin, Y. C. & Chung, K. J., 2019 二月 8, 於: Applied Sciences (Switzerland). 9, 3, 559.研究成果: Article › 同行評審
開啟存取1 引文 斯高帕斯（Scopus） -
The Prediction of Positioning shift for a Robot Arm Using Machine Learning Techniques
Huang, P. W. & Chung, K. J., 2019 十月, IMPACT 2019 - 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceeding. IEEE Computer Society, p. 58-61 4 p. 9024996. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2019-October).研究成果: Conference contribution
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Prognostic-based reliability assessment of a wafer handling robot arm using Wiener stochastic process model and Monte Carlo simulation
Huang, J. H., Cheng, H. M., Li, Y. R. & Chung, K. J., 2018 一月 1, Proceedings - 24th ISSAT International Conference on Reliability and Quality in Design. Pham, H. (編輯). International Society of Science and Applied Technologies, p. 1-5 5 p. (Proceedings - 24th ISSAT International Conference on Reliability and Quality in Design).研究成果: Conference contribution
1 引文 斯高帕斯（Scopus） -