Abstract
The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction between transmitted and received signals and nearby circuits appear to be manageable. This technology can potentially be applied for implementation of a true single chip radio, on-chip and inter-chip communication systems, RFID tags, and others.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 111-113 |
| Number of pages | 3 |
| ISBN (Electronic) | 0780377974, 9780780377974 |
| DOIs | |
| Publication status | Published - 2003 Jan 1 |
| Event | 2003 IEEE International Interconnect Technology Conference, IITC 2003 - Burlingame, United States Duration: 2003 Jun 2 → 2003 Jun 4 |
Publication series
| Name | Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003 |
|---|
Other
| Other | 2003 IEEE International Interconnect Technology Conference, IITC 2003 |
|---|---|
| Country | United States |
| City | Burlingame |
| Period | 03-06-02 → 03-06-04 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
Cite this
}
Wireless communications using integrated antennas. / O, K. K.; Kim, K.; Floyd, B.; Mehta, J.; Yoon, H.; Hung, C. M.; Bravo, D.; Dickson, T.; Guo, X.; Li, R.; Trichy, N.; Caserta, J.; Bomstad, W.; Branch, J.; Yang, D. J.; Bohorquez, J.; Gao, L.; Sugavanam, A.; Lin, J. J.; Chen, J.; Martin, F.; Brewer, J.
Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003. Institute of Electrical and Electronics Engineers Inc., 2003. p. 111-113 1219727 (Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Wireless communications using integrated antennas
AU - O, K. K.
AU - Kim, K.
AU - Floyd, B.
AU - Mehta, J.
AU - Yoon, H.
AU - Hung, C. M.
AU - Bravo, D.
AU - Dickson, T.
AU - Guo, X.
AU - Li, R.
AU - Trichy, N.
AU - Caserta, J.
AU - Bomstad, W.
AU - Branch, J.
AU - Yang, D. J.
AU - Bohorquez, J.
AU - Gao, L.
AU - Sugavanam, A.
AU - Lin, J. J.
AU - Chen, J.
AU - Martin, F.
AU - Brewer, J.
PY - 2003/1/1
Y1 - 2003/1/1
N2 - The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction between transmitted and received signals and nearby circuits appear to be manageable. This technology can potentially be applied for implementation of a true single chip radio, on-chip and inter-chip communication systems, RFID tags, and others.
AB - The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction between transmitted and received signals and nearby circuits appear to be manageable. This technology can potentially be applied for implementation of a true single chip radio, on-chip and inter-chip communication systems, RFID tags, and others.
UR - http://www.scopus.com/inward/record.url?scp=84944035888&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84944035888&partnerID=8YFLogxK
U2 - 10.1109/IITC.2003.1219727
DO - 10.1109/IITC.2003.1219727
M3 - Conference contribution
AN - SCOPUS:84944035888
T3 - Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003
SP - 111
EP - 113
BT - Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003
PB - Institute of Electrical and Electronics Engineers Inc.
ER -