Wireless communication in a flip-chip package using integrated antennas on silicon substrates

J. Branch, X. Guo, L. Gao, A. Sugavanam, Jau Jr Lin, K. K. O

Research output: Contribution to journalArticle

33 Citations (Scopus)

Abstract

An intrachip wireless interconnect using integrated antennas is demonstrated in a flip-chip ball grid array package. The wireless interconnect consists of a transmitter-receiver pair, which is fabricated in a 0.18-μm CMOS process. A 15-GHz signal is generated and broadcasted across the integrated circuit. The signal is picked up by a receiver 4 mm away on the same integrated circuit and frequency divided by eight to produce a 1.875-GHz local clock signal. The interconnection is also demonstrated between a transmitting antenna and a packaged receiver 40 cm away from the transmitting antenna. Demonstration of intrachip wireless interconnects in a package has been considered the ultimate test for this technology.

Original languageEnglish
Pages (from-to)115-117
Number of pages3
JournalIEEE Electron Device Letters
Volume26
Issue number2
DOIs
Publication statusPublished - 2005 Feb 1

Fingerprint

Silicon
Antennas
Integrated circuits
Communication
Substrates
Ball grid arrays
Transceivers
Clocks
Demonstrations
Wireless interconnects

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Branch, J. ; Guo, X. ; Gao, L. ; Sugavanam, A. ; Lin, Jau Jr ; O, K. K. / Wireless communication in a flip-chip package using integrated antennas on silicon substrates. In: IEEE Electron Device Letters. 2005 ; Vol. 26, No. 2. pp. 115-117.
@article{40a4774fbfca426ea6fce0eec7b5e5fe,
title = "Wireless communication in a flip-chip package using integrated antennas on silicon substrates",
abstract = "An intrachip wireless interconnect using integrated antennas is demonstrated in a flip-chip ball grid array package. The wireless interconnect consists of a transmitter-receiver pair, which is fabricated in a 0.18-μm CMOS process. A 15-GHz signal is generated and broadcasted across the integrated circuit. The signal is picked up by a receiver 4 mm away on the same integrated circuit and frequency divided by eight to produce a 1.875-GHz local clock signal. The interconnection is also demonstrated between a transmitting antenna and a packaged receiver 40 cm away from the transmitting antenna. Demonstration of intrachip wireless interconnects in a package has been considered the ultimate test for this technology.",
author = "J. Branch and X. Guo and L. Gao and A. Sugavanam and Lin, {Jau Jr} and O, {K. K.}",
year = "2005",
month = "2",
day = "1",
doi = "10.1109/LED.2004.841461",
language = "English",
volume = "26",
pages = "115--117",
journal = "IEEE Electron Device Letters",
issn = "0741-3106",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "2",

}

Wireless communication in a flip-chip package using integrated antennas on silicon substrates. / Branch, J.; Guo, X.; Gao, L.; Sugavanam, A.; Lin, Jau Jr; O, K. K.

In: IEEE Electron Device Letters, Vol. 26, No. 2, 01.02.2005, p. 115-117.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Wireless communication in a flip-chip package using integrated antennas on silicon substrates

AU - Branch, J.

AU - Guo, X.

AU - Gao, L.

AU - Sugavanam, A.

AU - Lin, Jau Jr

AU - O, K. K.

PY - 2005/2/1

Y1 - 2005/2/1

N2 - An intrachip wireless interconnect using integrated antennas is demonstrated in a flip-chip ball grid array package. The wireless interconnect consists of a transmitter-receiver pair, which is fabricated in a 0.18-μm CMOS process. A 15-GHz signal is generated and broadcasted across the integrated circuit. The signal is picked up by a receiver 4 mm away on the same integrated circuit and frequency divided by eight to produce a 1.875-GHz local clock signal. The interconnection is also demonstrated between a transmitting antenna and a packaged receiver 40 cm away from the transmitting antenna. Demonstration of intrachip wireless interconnects in a package has been considered the ultimate test for this technology.

AB - An intrachip wireless interconnect using integrated antennas is demonstrated in a flip-chip ball grid array package. The wireless interconnect consists of a transmitter-receiver pair, which is fabricated in a 0.18-μm CMOS process. A 15-GHz signal is generated and broadcasted across the integrated circuit. The signal is picked up by a receiver 4 mm away on the same integrated circuit and frequency divided by eight to produce a 1.875-GHz local clock signal. The interconnection is also demonstrated between a transmitting antenna and a packaged receiver 40 cm away from the transmitting antenna. Demonstration of intrachip wireless interconnects in a package has been considered the ultimate test for this technology.

UR - http://www.scopus.com/inward/record.url?scp=13444249992&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=13444249992&partnerID=8YFLogxK

U2 - 10.1109/LED.2004.841461

DO - 10.1109/LED.2004.841461

M3 - Article

AN - SCOPUS:13444249992

VL - 26

SP - 115

EP - 117

JO - IEEE Electron Device Letters

JF - IEEE Electron Device Letters

SN - 0741-3106

IS - 2

ER -