Thermal shock and resistance behavior relationship of bed occupancy sensor

Chuan Shih Wu, Sheng Yao Lin, Tsair Rong Chen

Research output: Contribution to journalArticle

Abstract

Ageing populations are driving demand for long-term healthcare. In this study, we developed a bed occupancy sensor, which works by generating a small electrical current when a load is applied to a "sensor pad", which then triggers an external electronic control device. When the load is removed, the circuit is broken, and a signal is sent to healthcare providers, alerting them that the patient has gotten out of bed. The connection between the sensing device and the nursing station could also be used to provide an emergency call functionality. We then evaluated the reliability of the sensor pads by applying thermal shocks and repeated loading. Changes in electrical resistance were used to determine the relationship between the three. We then observed variations of the surface state using scanning electron microscopy and atomic force microscopy, as a reference for future oil ink smear adjustments. Future research could focus on other functions, such as the detection of pressure distribution, the measurement of respiratory signals, and the assessment of sleep quality. Automating the monitoring of these aspects of care could help to reduce the pressure on healthcare personnel and provide additional patient data in cases of home care.

Original languageEnglish
Pages (from-to)33-41
Number of pages9
JournalSensors and Materials
Volume28
Issue number1
DOIs
Publication statusPublished - 2016 Jan 1

Fingerprint

thermal shock
Thermal shock
thermal resistance
Heat resistance
beds
sensors
Sensors
sleep
smear
electronic control
Acoustic impedance
control equipment
Nursing
emergencies
Surface states
inks
personnel
electrical resistance
pressure distribution
Ink

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Instrumentation

Cite this

Wu, Chuan Shih ; Lin, Sheng Yao ; Chen, Tsair Rong. / Thermal shock and resistance behavior relationship of bed occupancy sensor. In: Sensors and Materials. 2016 ; Vol. 28, No. 1. pp. 33-41.
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Thermal shock and resistance behavior relationship of bed occupancy sensor. / Wu, Chuan Shih; Lin, Sheng Yao; Chen, Tsair Rong.

In: Sensors and Materials, Vol. 28, No. 1, 01.01.2016, p. 33-41.

Research output: Contribution to journalArticle

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