The studied of the acrylic material drilling used by the CO2 laser

Ming-Fei Chen, Y. P. Chen, W. T. Hsiao

Research output: Contribution to journalConference article

Abstract

Laser processing which used in the 3C industry is the new technology. The PCB (printed circuit board) Laser drilling is the new manufacturing process for the PCB industry. In this paper we report the results of an investigation exploring the feasibility of laser drilling microvias. The process relies on the use of pulses from a CO2 laser to drilling small holes in the panels of acrylic. There are two part of this paper, first we will drilling the small holes of the acrylic by the different parameter of the laser (pulse width, repetitive frequency, mask size and etc.). There are two result of this paper; first we find the repetitive frequency and mask size will be change the holes diameter and depth, and the pulse width will affect the quality of the drilling holes. In Addition we can find the optimal process parameter by this paper.

Original languageEnglish
Article number104
Pages (from-to)837-843
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5448
Issue numberPART 2
DOIs
Publication statusPublished - 2004 Dec 1
EventHigh-Power Laser Ablation V - Taos, NM, United States
Duration: 2004 Apr 252004 Apr 30

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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