The numerical analysis of strain behavior at the solder joint and interface in a flip chip package

S. C. Chen, Y. C. Lin, C. H. Cheng

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)

Fingerprint Dive into the research topics of 'The numerical analysis of strain behavior at the solder joint and interface in a flip chip package'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science