The new technology of the materials process: Microvia formation by CO 2 laser drilling machine

Ming Fei Chen, Yu Pin Chen

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)


The purpose of this paper is the microvia results of different materials (RCC, FR4 and Cu) using CO2 laser drilling machine at the wavelength of 10600 nm. We investigated the mechanism of this process with CO2 laser and the microvia results of different materials. The microvia with a diameter up to 150 microns through laser drilling are presented. In this paper we report the results of a dielectric material such as the RCC and FR4 which used the different parameter of laser. In addition, the high power required for drilling copper foil compared to the resin material is due to the low absorption and high reflection of copper around 10600 nm wavelengths. We will present the method of the copper drilling based on a CO2 laser drilling machine system which used the low power.

Original languageEnglish
Article number74
Pages (from-to)522-527
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Publication statusPublished - 2005 Aug 22
EventPhoton Processing in Microelectronics and Photonics IV - San Jose, CA, United States
Duration: 2005 Jan 242005 Jan 27

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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