The investigation of modified norris-landzberg acceleration models for reliability assessment of ball grid array packages

Kuan-Jung Chung, Liyu Yang, Bing Yu Wang, Chia Che Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Norris-Landzberg acceleration model, only applying the conditions of the temperature cycling tests such as temperature range, maximum of temperature and cycle times, has been widely using to predict the lifetimes of electronic packages since 1969, due to its simplicity not considering complex damage information such as stress-strain relationships. During the last few years, a number of researches have shown that the N-L model exponents are not constant depending on the type of packages and solder materials (ex. the transition from SnPb solders to lead free solders like SnAgCu alloy) resulting in the variation of acceleration factors. It will increase the average errors of prediction if the original model is continually using without any modification especially for Ball Grid Array (BGA) packages since they are nowadays in the majority in this industry with many types for different applications, moreover, commonly stress-sensitive. The lifetime data of several BGAs presented in this study show that these exponents and acceleration factors depends on the different solder materials, solder pastes, design parameters ( die size, package size, ball pitch, and ball size), and even prebaking conditions. Therefore, the modification of N-L model is necessary for the BGAs in order to precisely predict their lifetimes in the field level. According to our survey, not many modified N-L models are presented for all packages. In this paper, two modified N-L models developed by Salmela and Dauksher were introduced respectively since they are likely to easy use. Compared to the original model developed by Norris and Landzberg, Salmela demonstrated that his stress-dependent model is able to reduce the average errors of prediction from 52.4% to 17.8% using the data with respect to different package types and solder materials. Our data were applied to validate Salmela's model, and the results show that the average errors of prediction decrease from 41% to 32%. In case of Dauksher's model, the average errors of prediction also decrease from 41% to 36%. As the results, our data have demonstrated that these two models are capable of providing the better accuracy in predicting the lifetimes of BGAs compared to the original N-L model, though they have improved yet the average errors so much. Furthermore, the Norris-Landzberg-based acceleration models may keep its validity on the reliability assessment of Ball Grid Array packages.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
Publication statusPublished - 2010 Dec 1
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
Duration: 2010 Oct 202010 Oct 22

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan
CityTaipei
Period10-10-2010-10-22

Fingerprint

Ball grid arrays
Soldering alloys
Temperature

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Chung, K-J., Yang, L., Wang, B. Y., & Wu, C. C. (2010). The investigation of modified norris-landzberg acceleration models for reliability assessment of ball grid array packages. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings [5699640] (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). https://doi.org/10.1109/IMPACT.2010.5699640
Chung, Kuan-Jung ; Yang, Liyu ; Wang, Bing Yu ; Wu, Chia Che. / The investigation of modified norris-landzberg acceleration models for reliability assessment of ball grid array packages. International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).
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abstract = "Norris-Landzberg acceleration model, only applying the conditions of the temperature cycling tests such as temperature range, maximum of temperature and cycle times, has been widely using to predict the lifetimes of electronic packages since 1969, due to its simplicity not considering complex damage information such as stress-strain relationships. During the last few years, a number of researches have shown that the N-L model exponents are not constant depending on the type of packages and solder materials (ex. the transition from SnPb solders to lead free solders like SnAgCu alloy) resulting in the variation of acceleration factors. It will increase the average errors of prediction if the original model is continually using without any modification especially for Ball Grid Array (BGA) packages since they are nowadays in the majority in this industry with many types for different applications, moreover, commonly stress-sensitive. The lifetime data of several BGAs presented in this study show that these exponents and acceleration factors depends on the different solder materials, solder pastes, design parameters ( die size, package size, ball pitch, and ball size), and even prebaking conditions. Therefore, the modification of N-L model is necessary for the BGAs in order to precisely predict their lifetimes in the field level. According to our survey, not many modified N-L models are presented for all packages. In this paper, two modified N-L models developed by Salmela and Dauksher were introduced respectively since they are likely to easy use. Compared to the original model developed by Norris and Landzberg, Salmela demonstrated that his stress-dependent model is able to reduce the average errors of prediction from 52.4{\%} to 17.8{\%} using the data with respect to different package types and solder materials. Our data were applied to validate Salmela's model, and the results show that the average errors of prediction decrease from 41{\%} to 32{\%}. In case of Dauksher's model, the average errors of prediction also decrease from 41{\%} to 36{\%}. As the results, our data have demonstrated that these two models are capable of providing the better accuracy in predicting the lifetimes of BGAs compared to the original N-L model, though they have improved yet the average errors so much. Furthermore, the Norris-Landzberg-based acceleration models may keep its validity on the reliability assessment of Ball Grid Array packages.",
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Chung, K-J, Yang, L, Wang, BY & Wu, CC 2010, The investigation of modified norris-landzberg acceleration models for reliability assessment of ball grid array packages. in International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings., 5699640, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Taipei, Taiwan, 10-10-20. https://doi.org/10.1109/IMPACT.2010.5699640

The investigation of modified norris-landzberg acceleration models for reliability assessment of ball grid array packages. / Chung, Kuan-Jung; Yang, Liyu; Wang, Bing Yu; Wu, Chia Che.

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. 5699640 (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - Norris-Landzberg acceleration model, only applying the conditions of the temperature cycling tests such as temperature range, maximum of temperature and cycle times, has been widely using to predict the lifetimes of electronic packages since 1969, due to its simplicity not considering complex damage information such as stress-strain relationships. During the last few years, a number of researches have shown that the N-L model exponents are not constant depending on the type of packages and solder materials (ex. the transition from SnPb solders to lead free solders like SnAgCu alloy) resulting in the variation of acceleration factors. It will increase the average errors of prediction if the original model is continually using without any modification especially for Ball Grid Array (BGA) packages since they are nowadays in the majority in this industry with many types for different applications, moreover, commonly stress-sensitive. The lifetime data of several BGAs presented in this study show that these exponents and acceleration factors depends on the different solder materials, solder pastes, design parameters ( die size, package size, ball pitch, and ball size), and even prebaking conditions. Therefore, the modification of N-L model is necessary for the BGAs in order to precisely predict their lifetimes in the field level. According to our survey, not many modified N-L models are presented for all packages. In this paper, two modified N-L models developed by Salmela and Dauksher were introduced respectively since they are likely to easy use. Compared to the original model developed by Norris and Landzberg, Salmela demonstrated that his stress-dependent model is able to reduce the average errors of prediction from 52.4% to 17.8% using the data with respect to different package types and solder materials. Our data were applied to validate Salmela's model, and the results show that the average errors of prediction decrease from 41% to 32%. In case of Dauksher's model, the average errors of prediction also decrease from 41% to 36%. As the results, our data have demonstrated that these two models are capable of providing the better accuracy in predicting the lifetimes of BGAs compared to the original N-L model, though they have improved yet the average errors so much. Furthermore, the Norris-Landzberg-based acceleration models may keep its validity on the reliability assessment of Ball Grid Array packages.

AB - Norris-Landzberg acceleration model, only applying the conditions of the temperature cycling tests such as temperature range, maximum of temperature and cycle times, has been widely using to predict the lifetimes of electronic packages since 1969, due to its simplicity not considering complex damage information such as stress-strain relationships. During the last few years, a number of researches have shown that the N-L model exponents are not constant depending on the type of packages and solder materials (ex. the transition from SnPb solders to lead free solders like SnAgCu alloy) resulting in the variation of acceleration factors. It will increase the average errors of prediction if the original model is continually using without any modification especially for Ball Grid Array (BGA) packages since they are nowadays in the majority in this industry with many types for different applications, moreover, commonly stress-sensitive. The lifetime data of several BGAs presented in this study show that these exponents and acceleration factors depends on the different solder materials, solder pastes, design parameters ( die size, package size, ball pitch, and ball size), and even prebaking conditions. Therefore, the modification of N-L model is necessary for the BGAs in order to precisely predict their lifetimes in the field level. According to our survey, not many modified N-L models are presented for all packages. In this paper, two modified N-L models developed by Salmela and Dauksher were introduced respectively since they are likely to easy use. Compared to the original model developed by Norris and Landzberg, Salmela demonstrated that his stress-dependent model is able to reduce the average errors of prediction from 52.4% to 17.8% using the data with respect to different package types and solder materials. Our data were applied to validate Salmela's model, and the results show that the average errors of prediction decrease from 41% to 32%. In case of Dauksher's model, the average errors of prediction also decrease from 41% to 36%. As the results, our data have demonstrated that these two models are capable of providing the better accuracy in predicting the lifetimes of BGAs compared to the original N-L model, though they have improved yet the average errors so much. Furthermore, the Norris-Landzberg-based acceleration models may keep its validity on the reliability assessment of Ball Grid Array packages.

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Chung K-J, Yang L, Wang BY, Wu CC. The investigation of modified norris-landzberg acceleration models for reliability assessment of ball grid array packages. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. 5699640. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). https://doi.org/10.1109/IMPACT.2010.5699640