The influence of cross-tie wall on the magnetoresistance of patterned permalloy films

J. C. Wu, H. M. Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Driven by the potential applications in data storage and the understanding of the fundamental micromagnetism, nanostructured magnetic thin films have been under intensive investigation. The recent advances in the nanofabrication and microscopy of the magnetic domain structures have led to more optimization of the magnetic field sensors. We present a correlation between the magnetization evolution in patterned elliptical Permalloy elements and their corresponding magnetoresistance (MR).

Original languageEnglish
Title of host publicationINTERMAG Europe 2002 - IEEE International Magnetics Conference
EditorsJ. Fidler, B. Hillebrands, C. Ross, D. Weller, L. Folks, E. Hill, M. Vazquez Villalabeitia, J. A. Bain, Jo De Boeck, R. Wood
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)0780373650, 9780780373655
DOIs
Publication statusPublished - 2002 Jan 1
Event2002 IEEE International Magnetics Conference, INTERMAG Europe 2002 - Amsterdam, Netherlands
Duration: 2002 Apr 282002 May 2

Publication series

NameINTERMAG Europe 2002 - IEEE International Magnetics Conference

Other

Other2002 IEEE International Magnetics Conference, INTERMAG Europe 2002
CountryNetherlands
CityAmsterdam
Period02-04-2802-05-02

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Surfaces, Coatings and Films

Cite this

Wu, J. C., & Lee, H. M. (2002). The influence of cross-tie wall on the magnetoresistance of patterned permalloy films. In J. Fidler, B. Hillebrands, C. Ross, D. Weller, L. Folks, E. Hill, M. Vazquez Villalabeitia, J. A. Bain, J. De Boeck, ... R. Wood (Eds.), INTERMAG Europe 2002 - IEEE International Magnetics Conference [1001217] (INTERMAG Europe 2002 - IEEE International Magnetics Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/INTMAG.2002.1001217