The impact of lead-free soldering on electronics packages

L. Yang, J. B. Bernstein, Kuan-Jung Chung

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Fingerprint Dive into the research topics of 'The impact of lead-free soldering on electronics packages'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy