The impact of lead-free soldering on electronics packages

L. Yang, J. B. Bernstein, Kuan-Jung Chung

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

This paper will review the challenges brought by lead-free soldering and some preliminary experimental evaluation results will be discussed. The initial results show that the lead-free soldering process with 260 C reflow peak temperature does not directly cause failures for bismaleimide-triazine (BT)-based fine pitch ball grid array (FPBGA) packages. However, the strict lead-free soldering condition could degrade the integrity of weak interface joints and potentially damage the package in subsequent unbiased highly accelerated stress test (unbiased HAST) evaluation. The impacts of lead free soldering with high reflow temperature on concurrent available electronics components could be more severe than previously believed. In the future, new materials and design concepts should be applied to enhance the package reliability under strict lead-free soldering conditions.

Original languageEnglish
Pages (from-to)20-26
Number of pages7
JournalMicroelectronics International
Volume18
Issue number3
DOIs
Publication statusPublished - 2001 Sep 1

Fingerprint

soldering
Soldering
Electronic equipment
Lead
electronics
bismaleimide
Triazines
Ball grid arrays
evaluation
integrity
balls
grids
damage
Temperature
causes

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Yang, L. ; Bernstein, J. B. ; Chung, Kuan-Jung. / The impact of lead-free soldering on electronics packages. In: Microelectronics International. 2001 ; Vol. 18, No. 3. pp. 20-26.
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The impact of lead-free soldering on electronics packages. / Yang, L.; Bernstein, J. B.; Chung, Kuan-Jung.

In: Microelectronics International, Vol. 18, No. 3, 01.09.2001, p. 20-26.

Research output: Contribution to journalArticle

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