Template based high packing density assembly for microchip solid state cooling application

Kerwin Wang, Rajashree Baskaran, Karl F. Böhringer

Research output: Contribution to conferencePaper

4 Citations (Scopus)

Abstract

100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130- 800μm.

Original languageEnglish
Pages54-58
Number of pages5
Publication statusPublished - 2006 Dec 1
Event3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006 - Snowbird, UT, United States
Duration: 2006 Apr 232006 Apr 27

Other

Other3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006
CountryUnited States
CitySnowbird, UT
Period06-04-2306-04-27

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Cooling

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Wang, K., Baskaran, R., & Böhringer, K. F. (2006). Template based high packing density assembly for microchip solid state cooling application. 54-58. Paper presented at 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006, Snowbird, UT, United States.
Wang, Kerwin ; Baskaran, Rajashree ; Böhringer, Karl F. / Template based high packing density assembly for microchip solid state cooling application. Paper presented at 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006, Snowbird, UT, United States.5 p.
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Wang, K, Baskaran, R & Böhringer, KF 2006, 'Template based high packing density assembly for microchip solid state cooling application' Paper presented at 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006, Snowbird, UT, United States, 06-04-23 - 06-04-27, pp. 54-58.

Template based high packing density assembly for microchip solid state cooling application. / Wang, Kerwin; Baskaran, Rajashree; Böhringer, Karl F.

2006. 54-58 Paper presented at 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006, Snowbird, UT, United States.

Research output: Contribution to conferencePaper

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AU - Baskaran, Rajashree

AU - Böhringer, Karl F.

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Wang K, Baskaran R, Böhringer KF. Template based high packing density assembly for microchip solid state cooling application. 2006. Paper presented at 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006, Snowbird, UT, United States.