Template based high packing density assembly for microchip solid state cooling application

Kerwin Wang, Rajashree Baskaran, Karl F. Böhringer

Research output: Contribution to conferencePaper

4 Citations (Scopus)

Abstract

100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130- 800μm.

Original languageEnglish
Pages54-58
Number of pages5
Publication statusPublished - 2006 Dec 1
Event3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006 - Snowbird, UT, United States
Duration: 2006 Apr 232006 Apr 27

Other

Other3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006
CountryUnited States
CitySnowbird, UT
Period06-04-2306-04-27

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All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Wang, K., Baskaran, R., & Böhringer, K. F. (2006). Template based high packing density assembly for microchip solid state cooling application. 54-58. Paper presented at 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006, Snowbird, UT, United States.