Abstract
100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130- 800μm.
| Original language | English |
|---|---|
| Pages | 54-58 |
| Number of pages | 5 |
| Publication status | Published - 2006 Dec 1 |
| Event | 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006 - Snowbird, UT, United States Duration: 2006 Apr 23 → 2006 Apr 27 |
Other
| Other | 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006 |
|---|---|
| Country | United States |
| City | Snowbird, UT |
| Period | 06-04-23 → 06-04-27 |
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
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Cite this
Wang, K., Baskaran, R., & Böhringer, K. F. (2006). Template based high packing density assembly for microchip solid state cooling application. 54-58. Paper presented at 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006, Snowbird, UT, United States.