Template based high packing density assembly for microchip solid state cooling application

Kerwin Wang; Rajashree Baskaran; Karl F. Böhringer

Template based high packing density assembly for microchip solid state cooling application

Kerwin Wang, Rajashree Baskaran, Karl F. Böhringer

Department of Mechatronic Engineering

Research output: Contribution to conference › Paper › peer-review

4 Citations (Scopus)

Abstract

100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130- 800μm.

Original language	English
Pages	54-58
Number of pages	5
Publication status	Published - 2006 Dec 1
Event	3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006 - Snowbird, UT, United States Duration: 2006 Apr 23 → 2006 Apr 27

Other

Other	3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006
Country	United States
City	Snowbird, UT
Period	06-04-23 → 06-04-27

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

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title = "Template based high packing density assembly for microchip solid state cooling application",

abstract = "100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130- 800μm.",

author = "Kerwin Wang and Rajashree Baskaran and B{\"o}hringer, {Karl F.}",

year = "2006",

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Template based high packing density assembly for microchip solid state cooling application. / Wang, Kerwin; Baskaran, Rajashree; Böhringer, Karl F.

2006. 54-58 Paper presented at 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006, Snowbird, UT, United States.

Research output: Contribution to conference › Paper › peer-review

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AU - Baskaran, Rajashree

AU - Böhringer, Karl F.

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AB - 100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130- 800μm.

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