Abstract
100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130- 800μm.
| Original language | English |
|---|---|
| Pages | 54-58 |
| Number of pages | 5 |
| Publication status | Published - 2006 Dec 1 |
| Event | 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006 - Snowbird, UT, United States Duration: 2006 Apr 23 → 2006 Apr 27 |
Other
| Other | 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006 |
|---|---|
| Country | United States |
| City | Snowbird, UT |
| Period | 06-04-23 → 06-04-27 |
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All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
Cite this
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Template based high packing density assembly for microchip solid state cooling application. / Wang, Kerwin; Baskaran, Rajashree; Böhringer, Karl F.
2006. 54-58 Paper presented at 3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006, Snowbird, UT, United States.Research output: Contribution to conference › Paper
TY - CONF
T1 - Template based high packing density assembly for microchip solid state cooling application
AU - Wang, Kerwin
AU - Baskaran, Rajashree
AU - Böhringer, Karl F.
PY - 2006/12/1
Y1 - 2006/12/1
N2 - 100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130- 800μm.
AB - 100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130- 800μm.
UR - http://www.scopus.com/inward/record.url?scp=84874715439&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84874715439&partnerID=8YFLogxK
M3 - Paper
AN - SCOPUS:84874715439
SP - 54
EP - 58
ER -