Template based assembly for solid state cooling

Kerwin Wang; Rajashree Baskaran; Karl F. Böhringer

doi:10.1115/IPACK2007-33474

Template based assembly for solid state cooling

Kerwin Wang, Rajashree Baskaran, Karl F. Böhringer

Department of Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.

Original language	English
Title of host publication	2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Pages	435-437
Number of pages	3
DOIs	https://doi.org/10.1115/IPACK2007-33474
Publication status	Published - 2007
Event	ASME Electronic and Photonics Packaging Division - Vancouver, BC, United States Duration: 2007 Jul 8 → 2007 Jul 12

Publication series

Name	2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume	1

Other

Other	ASME Electronic and Photonics Packaging Division
Country	United States
City	Vancouver, BC
Period	07-07-08 → 07-07-12

All Science Journal Classification (ASJC) codes

Computer Networks and Communications
Computer Science Applications
Information Systems

Access to Document

10.1115/IPACK2007-33474

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Cite this

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title = "Template based assembly for solid state cooling",

abstract = "This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.",

author = "Kerwin Wang and Rajashree Baskaran and B{\"o}hringer, {Karl F.}",

year = "2007",

doi = "10.1115/IPACK2007-33474",

language = "English",

isbn = "0791842770",

series = "2007 Proceedings of the ASME InterPack Conference, IPACK 2007",

pages = "435--437",

booktitle = "2007 Proceedings of the ASME InterPack Conference, IPACK 2007",

}

Wang, K, Baskaran, R & Böhringer, KF 2007, Template based assembly for solid state cooling. in 2007 Proceedings of the ASME InterPack Conference, IPACK 2007. 2007 Proceedings of the ASME InterPack Conference, IPACK 2007, vol. 1, pp. 435-437, ASME Electronic and Photonics Packaging Division, Vancouver, BC, United States, 07-07-08. https://doi.org/10.1115/IPACK2007-33474

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AU - Wang, Kerwin

AU - Baskaran, Rajashree

AU - Böhringer, Karl F.

PY - 2007

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N2 - This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.

AB - This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.

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DO - 10.1115/IPACK2007-33474

M3 - Conference contribution

AN - SCOPUS:40449093475

SN - 0791842770

SN - 9780791842775

T3 - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007

SP - 435

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BT - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007

T2 - ASME Electronic and Photonics Packaging Division

Y2 - 8 July 2007 through 12 July 2007

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