TY - GEN
T1 - Template based assembly for solid state cooling
AU - Wang, Kerwin
AU - Baskaran, Rajashree
AU - Böhringer, Karl F.
N1 - Copyright:
Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2007
Y1 - 2007
N2 - This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.
AB - This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.
UR - http://www.scopus.com/inward/record.url?scp=40449093475&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=40449093475&partnerID=8YFLogxK
U2 - 10.1115/IPACK2007-33474
DO - 10.1115/IPACK2007-33474
M3 - Conference contribution
AN - SCOPUS:40449093475
SN - 0791842770
SN - 9780791842775
T3 - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
SP - 435
EP - 437
BT - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
T2 - ASME Electronic and Photonics Packaging Division
Y2 - 8 July 2007 through 12 July 2007
ER -