Abstract
This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.
| Original language | English |
|---|---|
| Title of host publication | 2007 Proceedings of the ASME InterPack Conference, IPACK 2007 |
| Pages | 435-437 |
| Number of pages | 3 |
| DOIs | |
| Publication status | Published - 2007 Dec 1 |
| Event | ASME Electronic and Photonics Packaging Division - Vancouver, BC, United States Duration: 2007 Jul 8 → 2007 Jul 12 |
Publication series
| Name | 2007 Proceedings of the ASME InterPack Conference, IPACK 2007 |
|---|---|
| Volume | 1 |
Other
| Other | ASME Electronic and Photonics Packaging Division |
|---|---|
| Country | United States |
| City | Vancouver, BC |
| Period | 07-07-08 → 07-07-12 |
All Science Journal Classification (ASJC) codes
- Computer Networks and Communications
- Computer Science Applications
- Information Systems
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Cite this
Wang, K., Baskaran, R., & Böhringer, K. F. (2007). Template based assembly for solid state cooling. In 2007 Proceedings of the ASME InterPack Conference, IPACK 2007 (pp. 435-437). (2007 Proceedings of the ASME InterPack Conference, IPACK 2007; Vol. 1). https://doi.org/10.1115/IPACK2007-33474