Template based assembly for solid state cooling

Kerwin Wang, Rajashree Baskaran, Karl F. Böhringer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Pages435-437
Number of pages3
DOIs
Publication statusPublished - 2007 Dec 1
EventASME Electronic and Photonics Packaging Division - Vancouver, BC, United States
Duration: 2007 Jul 82007 Jul 12

Publication series

Name2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume1

Other

OtherASME Electronic and Photonics Packaging Division
CountryUnited States
CityVancouver, BC
Period07-07-0807-07-12

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Computer Science Applications
  • Information Systems

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  • Cite this

    Wang, K., Baskaran, R., & Böhringer, K. F. (2007). Template based assembly for solid state cooling. In 2007 Proceedings of the ASME InterPack Conference, IPACK 2007 (pp. 435-437). (2007 Proceedings of the ASME InterPack Conference, IPACK 2007; Vol. 1). https://doi.org/10.1115/IPACK2007-33474