Surface wettability of silicon substrates enhanced by laser ablation

Shih Feng Tseng, Wen Tse Hsiao, Ming Fei Chen, Kuo Cheng Huang, Sheng Yi Hsiao, Yung Sheng Lin, Chang Pin Chou

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

Laser-ablation techniques have been widely applied for removing material from a solid surface using a laser-beam irradiating apparatus. This paper presents a surface-texturing technique to create rough patterns on a silicon substrate using a pulsed Nd:YAG laser system. The different degrees of microstructure and surface roughness were adjusted by the laser fluence and laser pulse duration. A scanning electron microscope (SEM) and a 3D confocal laser-scanning microscope are used to measure the surface micrograph and roughness of the patterns, respectively. The contact angle variations between droplets on the textured surface were measured using an FTA 188 video contact angle analyzer. The results indicate that increasing the values of laser fluence and laser pulse duration pushes more molten slag piled around these patterns to create micro-sized craters and leads to an increase in the crater height and surface roughness. A typical example of a droplet on a laser-textured surface shows that the droplet spreads very quickly and almost disappears within 0.5167 s, compared to a contact angle of 47.9° on an untextured surface. This processing technique can also be applied to fabricating Si solar panels to increase the absorption efficiency of light.

Original languageEnglish
Pages (from-to)303-308
Number of pages6
JournalApplied Physics A: Materials Science and Processing
Volume101
Issue number2
DOIs
Publication statusPublished - 2010 Nov 1

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)

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