Self-assembly of MEMS components in air assisted by diaphragm agitation

Sheng Hsiune Liang, Kerwin Wang, Karl F. Böhringer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

We present a fast and high yield self-assembly process in air for sub-millimeter components, including released MEMS chips. Components are agitated on a vibrating diaphragm and captured on a substrate with downward facing binding sites. Low drag force in air, high capillary force at the air/liquid interface, and fast recycling of components contribute to high performance. In addition, we investigate the quantitative relationship between process parameters and assembly performance. Energy transfer from agitation source to components is measured and characterized; yield ratios and self-correcting processes for various applied energies are obtained from experimental results. The assembly rate and yield ratio are controlled by the driving signal and reach up to 0.125 components/sec-site and 93%, respectively. The process has been applied successfully to the assembly of MEMS chips with released comb drives.

Original languageEnglish
Title of host publicationProceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest
Pages592-595
Number of pages4
DOIs
Publication statusPublished - 2005 Oct 25
Event18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States
Duration: 2005 Jan 302005 Feb 3

Other

Other18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami
CountryUnited States
CityMiami Beach, FL
Period05-01-3005-02-03

Fingerprint

agitation
diaphragms
Diaphragms
Self assembly
microelectromechanical systems
MEMS
self assembly
air
Air
assembly
Binding sites
Energy transfer
chips
Drag
Recycling
Binding Sites
liquid air
recycling
drag
Liquids

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Liang, S. H., Wang, K., & Böhringer, K. F. (2005). Self-assembly of MEMS components in air assisted by diaphragm agitation. In Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest (pp. 592-595). [TPb42] https://doi.org/10.1109/MEMSYS.2005.1453999
Liang, Sheng Hsiune ; Wang, Kerwin ; Böhringer, Karl F. / Self-assembly of MEMS components in air assisted by diaphragm agitation. Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest. 2005. pp. 592-595
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Liang, SH, Wang, K & Böhringer, KF 2005, Self-assembly of MEMS components in air assisted by diaphragm agitation. in Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest., TPb42, pp. 592-595, 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami, Miami Beach, FL, United States, 05-01-30. https://doi.org/10.1109/MEMSYS.2005.1453999

Self-assembly of MEMS components in air assisted by diaphragm agitation. / Liang, Sheng Hsiune; Wang, Kerwin; Böhringer, Karl F.

Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest. 2005. p. 592-595 TPb42.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - We present a fast and high yield self-assembly process in air for sub-millimeter components, including released MEMS chips. Components are agitated on a vibrating diaphragm and captured on a substrate with downward facing binding sites. Low drag force in air, high capillary force at the air/liquid interface, and fast recycling of components contribute to high performance. In addition, we investigate the quantitative relationship between process parameters and assembly performance. Energy transfer from agitation source to components is measured and characterized; yield ratios and self-correcting processes for various applied energies are obtained from experimental results. The assembly rate and yield ratio are controlled by the driving signal and reach up to 0.125 components/sec-site and 93%, respectively. The process has been applied successfully to the assembly of MEMS chips with released comb drives.

AB - We present a fast and high yield self-assembly process in air for sub-millimeter components, including released MEMS chips. Components are agitated on a vibrating diaphragm and captured on a substrate with downward facing binding sites. Low drag force in air, high capillary force at the air/liquid interface, and fast recycling of components contribute to high performance. In addition, we investigate the quantitative relationship between process parameters and assembly performance. Energy transfer from agitation source to components is measured and characterized; yield ratios and self-correcting processes for various applied energies are obtained from experimental results. The assembly rate and yield ratio are controlled by the driving signal and reach up to 0.125 components/sec-site and 93%, respectively. The process has been applied successfully to the assembly of MEMS chips with released comb drives.

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Liang SH, Wang K, Böhringer KF. Self-assembly of MEMS components in air assisted by diaphragm agitation. In Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest. 2005. p. 592-595. TPb42 https://doi.org/10.1109/MEMSYS.2005.1453999