Self-assembly of MEMS components in air assisted by diaphragm agitation

Sheng Hsiune Liang, Kerwin Wang, Karl F. Böhringer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

We present a fast and high yield self-assembly process in air for sub-millimeter components, including released MEMS chips. Components are agitated on a vibrating diaphragm and captured on a substrate with downward facing binding sites. Low drag force in air, high capillary force at the air/liquid interface, and fast recycling of components contribute to high performance. In addition, we investigate the quantitative relationship between process parameters and assembly performance. Energy transfer from agitation source to components is measured and characterized; yield ratios and self-correcting processes for various applied energies are obtained from experimental results. The assembly rate and yield ratio are controlled by the driving signal and reach up to 0.125 components/sec-site and 93%, respectively. The process has been applied successfully to the assembly of MEMS chips with released comb drives.

Original languageEnglish
Title of host publicationProceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest
Pages592-595
Number of pages4
DOIs
Publication statusPublished - 2005
Event18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States
Duration: 2005 Jan 302005 Feb 3

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami
CountryUnited States
CityMiami Beach, FL
Period05-01-3005-02-03

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Self-assembly of MEMS components in air assisted by diaphragm agitation'. Together they form a unique fingerprint.

Cite this