Abstract
We present a fast and high yield self-assembly process in air for sub-millimeter components, including released MEMS chips. Components are agitated on a vibrating diaphragm and captured on a substrate with downward facing binding sites. Low drag force in air, high capillary force at the air/liquid interface, and fast recycling of components contribute to high performance. In addition, we investigate the quantitative relationship between process parameters and assembly performance. Energy transfer from agitation source to components is measured and characterized; yield ratios and self-correcting processes for various applied energies are obtained from experimental results. The assembly rate and yield ratio are controlled by the driving signal and reach up to 0.125 components/sec-site and 93%, respectively. The process has been applied successfully to the assembly of MEMS chips with released comb drives.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest |
| Pages | 592-595 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2005 Oct 25 |
| Event | 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States Duration: 2005 Jan 30 → 2005 Feb 3 |
Other
| Other | 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami |
|---|---|
| Country | United States |
| City | Miami Beach, FL |
| Period | 05-01-30 → 05-02-03 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Mechanical Engineering
- Electrical and Electronic Engineering
Cite this
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Self-assembly of MEMS components in air assisted by diaphragm agitation. / Liang, Sheng Hsiune; Wang, Kerwin; Böhringer, Karl F.
Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest. 2005. p. 592-595 TPb42.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Self-assembly of MEMS components in air assisted by diaphragm agitation
AU - Liang, Sheng Hsiune
AU - Wang, Kerwin
AU - Böhringer, Karl F.
PY - 2005/10/25
Y1 - 2005/10/25
N2 - We present a fast and high yield self-assembly process in air for sub-millimeter components, including released MEMS chips. Components are agitated on a vibrating diaphragm and captured on a substrate with downward facing binding sites. Low drag force in air, high capillary force at the air/liquid interface, and fast recycling of components contribute to high performance. In addition, we investigate the quantitative relationship between process parameters and assembly performance. Energy transfer from agitation source to components is measured and characterized; yield ratios and self-correcting processes for various applied energies are obtained from experimental results. The assembly rate and yield ratio are controlled by the driving signal and reach up to 0.125 components/sec-site and 93%, respectively. The process has been applied successfully to the assembly of MEMS chips with released comb drives.
AB - We present a fast and high yield self-assembly process in air for sub-millimeter components, including released MEMS chips. Components are agitated on a vibrating diaphragm and captured on a substrate with downward facing binding sites. Low drag force in air, high capillary force at the air/liquid interface, and fast recycling of components contribute to high performance. In addition, we investigate the quantitative relationship between process parameters and assembly performance. Energy transfer from agitation source to components is measured and characterized; yield ratios and self-correcting processes for various applied energies are obtained from experimental results. The assembly rate and yield ratio are controlled by the driving signal and reach up to 0.125 components/sec-site and 93%, respectively. The process has been applied successfully to the assembly of MEMS chips with released comb drives.
UR - http://www.scopus.com/inward/record.url?scp=26844493755&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=26844493755&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2005.1453999
DO - 10.1109/MEMSYS.2005.1453999
M3 - Conference contribution
AN - SCOPUS:26844493755
SN - 0780387325
SP - 592
EP - 595
BT - Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest
ER -