RF modeling of ball grid array packages using electromagnetic approaches

Yeong-Lin Lai, Cheng Yu Ho

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper presents radio-frequency (RF) modeling of ball grid array (BGA) packages with three-dimensional (3D) full-wave electromagnetic (EM) simulation. The effects of the signal traces, multi-layer substrates, bond wires, vias, and molding compounds are incorporated in the modeling of the BGA packages. The BGA packages with open-path and short-path configurations for RF measurement and modeling are studied. The RF characteristics of packages in terms of return loss and insertion loss are measured and simulated. The RF modeling results show that the EM approaches without any optimization process are able to provide good agreement between the measured and simulated S parameters of the BGA packages up to 5 GHz.

Original languageEnglish
Title of host publication10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004
Subtitle of host publicationIntegrated Systems on Silicon - Proceedings
Pages65-68
Number of pages4
Publication statusPublished - 2004 Dec 1
Event10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings - Suntec, Singapore
Duration: 2004 Sep 82004 Sep 10

Publication series

Name10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings

Other

Other10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings
CountrySingapore
CitySuntec
Period04-09-0804-09-10

Fingerprint

Ball grid arrays
Sheet molding compounds
Scattering parameters
Insertion losses
Electromagnetic waves
Wire
Substrates

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Lai, Y-L., & Ho, C. Y. (2004). RF modeling of ball grid array packages using electromagnetic approaches. In 10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings (pp. 65-68). (10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings).
Lai, Yeong-Lin ; Ho, Cheng Yu. / RF modeling of ball grid array packages using electromagnetic approaches. 10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings. 2004. pp. 65-68 (10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings).
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title = "RF modeling of ball grid array packages using electromagnetic approaches",
abstract = "This paper presents radio-frequency (RF) modeling of ball grid array (BGA) packages with three-dimensional (3D) full-wave electromagnetic (EM) simulation. The effects of the signal traces, multi-layer substrates, bond wires, vias, and molding compounds are incorporated in the modeling of the BGA packages. The BGA packages with open-path and short-path configurations for RF measurement and modeling are studied. The RF characteristics of packages in terms of return loss and insertion loss are measured and simulated. The RF modeling results show that the EM approaches without any optimization process are able to provide good agreement between the measured and simulated S parameters of the BGA packages up to 5 GHz.",
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Lai, Y-L & Ho, CY 2004, RF modeling of ball grid array packages using electromagnetic approaches. in 10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings. 10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings, pp. 65-68, 10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings, Suntec, Singapore, 04-09-08.

RF modeling of ball grid array packages using electromagnetic approaches. / Lai, Yeong-Lin; Ho, Cheng Yu.

10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings. 2004. p. 65-68 (10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - This paper presents radio-frequency (RF) modeling of ball grid array (BGA) packages with three-dimensional (3D) full-wave electromagnetic (EM) simulation. The effects of the signal traces, multi-layer substrates, bond wires, vias, and molding compounds are incorporated in the modeling of the BGA packages. The BGA packages with open-path and short-path configurations for RF measurement and modeling are studied. The RF characteristics of packages in terms of return loss and insertion loss are measured and simulated. The RF modeling results show that the EM approaches without any optimization process are able to provide good agreement between the measured and simulated S parameters of the BGA packages up to 5 GHz.

AB - This paper presents radio-frequency (RF) modeling of ball grid array (BGA) packages with three-dimensional (3D) full-wave electromagnetic (EM) simulation. The effects of the signal traces, multi-layer substrates, bond wires, vias, and molding compounds are incorporated in the modeling of the BGA packages. The BGA packages with open-path and short-path configurations for RF measurement and modeling are studied. The RF characteristics of packages in terms of return loss and insertion loss are measured and simulated. The RF modeling results show that the EM approaches without any optimization process are able to provide good agreement between the measured and simulated S parameters of the BGA packages up to 5 GHz.

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Lai Y-L, Ho CY. RF modeling of ball grid array packages using electromagnetic approaches. In 10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings. 2004. p. 65-68. (10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Systems on Silicon - Proceedings).