RF modeling of ball grid array packages using a coupled transmission line model

Yeong Lin Lai, Chia Long Wu, Kevin Chiang

Research output: Contribution to conferencePaper

5 Citations (Scopus)

Abstract

A novel method for radio-frequency (RF) modeling of ball grid array (BGA) packages is presented. A new analytical method is developed to extract the inductance characteristics of the package bond wires. With the extracted bond wire data, a cascaded multi-section coupled transmission line model is setup to describe the physical trace structures of the BGA packages. The multi-section π model representing the coupled transmission line effect of the signal traces is used for the RF modeling of the BGA packages. The BGA packages with open-path, short-path, through-path, and through-ground test configurations are studied. The simulated S parameter results exhibit great agreement with the measured ones for the BGA packages.

Original languageEnglish
Pages351-354
Number of pages4
Publication statusPublished - 2003
Event2003 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Philadelphia, PA, United States
Duration: 2003 Jun 82003 Jun 10

Other

Other2003 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
CountryUnited States
CityPhiladelphia, PA
Period03-06-0803-06-10

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Lai, Y. L., Wu, C. L., & Chiang, K. (2003). RF modeling of ball grid array packages using a coupled transmission line model. 351-354. Paper presented at 2003 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Philadelphia, PA, United States.