A novel method for radio-frequency (RF) modeling of ball grid array (BGA) packages is presented. A new analytical method is developed to extract the inductance characteristics of the package bond wires. With the extracted bond wire data, a cascaded multi-section coupled transmission line model is setup to describe the physical trace structures of the BGA packages. The multi-section π model representing the coupled transmission line effect of the signal traces is used for the RF modeling of the BGA packages. The BGA packages with open-path, short-path, through-path, and through-ground test configurations are studied. The simulated S parameter results exhibit great agreement with the measured ones for the BGA packages.
|Number of pages||4|
|Publication status||Published - 2003|
|Event||2003 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Philadelphia, PA, United States|
Duration: 2003 Jun 8 → 2003 Jun 10
|Other||2003 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium|
|Period||03-06-08 → 03-06-10|
All Science Journal Classification (ASJC) codes