RF modeling of ball grid array packages using a coupled transmission line model

Yeong Lin Lai, Chia Long Wu, Kevin Chiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

A novel method for radio-frequency (RF) modeling of ball grid array (BGA) packages is presented. A new analytical method is developed to extract the inductance characteristics of the package bond wires. With the extracted bond wire data, a cascaded multi-section coupled transmission line model is setup to describe the physical trace structures of the BGA packages. The multi-section π model representing the coupled transmission line effect of the signal traces is used for the RF modeling of the BGA packages. The BGA packages with open-path, short-path, through-path, and through-ground test configurations are studied. The simulated S parameter results exhibit great agreement with the measured ones for the BGA packages.

Original languageEnglish
Title of host publicationIEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers
EditorsT. Quach
Pages351-354
Number of pages4
Publication statusPublished - 2003 Aug 22
Event2003 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Philadelphia, PA, United States
Duration: 2003 Jun 82003 Jun 10

Other

Other2003 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
CountryUnited States
CityPhiladelphia, PA
Period03-06-0803-06-10

Fingerprint

Ball grid arrays
Electric lines
Wire
Scattering parameters
Inductance

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Lai, Y. L., Wu, C. L., & Chiang, K. (2003). RF modeling of ball grid array packages using a coupled transmission line model. In T. Quach (Ed.), IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers (pp. 351-354)
Lai, Yeong Lin ; Wu, Chia Long ; Chiang, Kevin. / RF modeling of ball grid array packages using a coupled transmission line model. IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers. editor / T. Quach. 2003. pp. 351-354
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Lai, YL, Wu, CL & Chiang, K 2003, RF modeling of ball grid array packages using a coupled transmission line model. in T Quach (ed.), IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers. pp. 351-354, 2003 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Philadelphia, PA, United States, 03-06-08.

RF modeling of ball grid array packages using a coupled transmission line model. / Lai, Yeong Lin; Wu, Chia Long; Chiang, Kevin.

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers. ed. / T. Quach. 2003. p. 351-354.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - A novel method for radio-frequency (RF) modeling of ball grid array (BGA) packages is presented. A new analytical method is developed to extract the inductance characteristics of the package bond wires. With the extracted bond wire data, a cascaded multi-section coupled transmission line model is setup to describe the physical trace structures of the BGA packages. The multi-section π model representing the coupled transmission line effect of the signal traces is used for the RF modeling of the BGA packages. The BGA packages with open-path, short-path, through-path, and through-ground test configurations are studied. The simulated S parameter results exhibit great agreement with the measured ones for the BGA packages.

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Lai YL, Wu CL, Chiang K. RF modeling of ball grid array packages using a coupled transmission line model. In Quach T, editor, IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers. 2003. p. 351-354