Researches of a novel 2D CMOS thermal based accelerometer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Conventionally the accelerometer behaves like a spring - mass system and its structures involve solid proof mass, which is allowed to move under acceleration conditions. In this paper, we design and fabrication a novel thermal-bubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. The proposed accelerometer based on thermal convection creates a tiny heated air bubble hermetically sealed inside the sensor package cavity. Four thermopiles around the center heater serve as the temperature sensors to detect two-dimension motion of the chip and also are adequately applied to the technology of inclinometers, anemometers and flow meters. A new micro-link structure is also proposed to enhance the construction of accelerometer with the micro heater and two pairs of thermopiles floating over an etched cavity. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining the sensor to evaluate the performance of this accelerometer.

Original languageEnglish
Title of host publicationAdvanced Manufacture
Subtitle of host publicationFocusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture
PublisherTrans Tech Publications Ltd
Pages84-89
Number of pages6
ISBN (Print)9770255547605
DOIs
Publication statusPublished - 2008 Jan 1
Event2007 SME International Conference on Advanced Manufacture, SME ICAM 2007 - Tainan, Taiwan
Duration: 2008 Nov 262008 Nov 28

Publication series

NameMaterials Science Forum
Volume594
ISSN (Print)0255-5476

Other

Other2007 SME International Conference on Advanced Manufacture, SME ICAM 2007
CountryTaiwan
CityTainan
Period08-11-2608-11-28

Fingerprint

Thermopiles
thermopiles
accelerometers
Accelerometers
CMOS
heaters
bubbles
anemometers
cavities
sensors
Anemometers
Sensors
temperature sensors
Temperature sensors
heat transmission
free convection
floating
chips
Hot Temperature
Heat transfer

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Shen, C-H., Chen, S. J., & Yang, Y. T. (2008). Researches of a novel 2D CMOS thermal based accelerometer. In Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture (pp. 84-89). (Materials Science Forum; Vol. 594). Trans Tech Publications Ltd. https://doi.org/10.4028/0-87849-360-3.84
Shen, Chih-Hsiung ; Chen, Shu Jung ; Yang, Yin Ting. / Researches of a novel 2D CMOS thermal based accelerometer. Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture. Trans Tech Publications Ltd, 2008. pp. 84-89 (Materials Science Forum).
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Shen, C-H, Chen, SJ & Yang, YT 2008, Researches of a novel 2D CMOS thermal based accelerometer. in Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture. Materials Science Forum, vol. 594, Trans Tech Publications Ltd, pp. 84-89, 2007 SME International Conference on Advanced Manufacture, SME ICAM 2007, Tainan, Taiwan, 08-11-26. https://doi.org/10.4028/0-87849-360-3.84

Researches of a novel 2D CMOS thermal based accelerometer. / Shen, Chih-Hsiung; Chen, Shu Jung; Yang, Yin Ting.

Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture. Trans Tech Publications Ltd, 2008. p. 84-89 (Materials Science Forum; Vol. 594).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Shen C-H, Chen SJ, Yang YT. Researches of a novel 2D CMOS thermal based accelerometer. In Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture. Trans Tech Publications Ltd. 2008. p. 84-89. (Materials Science Forum). https://doi.org/10.4028/0-87849-360-3.84