Abstract
Conventionally the accelerometer behaves like a spring - mass system and its structures involve solid proof mass, which is allowed to move under acceleration conditions. In this paper, we design and fabrication a novel thermal-bubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. The proposed accelerometer based on thermal convection creates a tiny heated air bubble hermetically sealed inside the sensor package cavity. Four thermopiles around the center heater serve as the temperature sensors to detect two-dimension motion of the chip and also are adequately applied to the technology of inclinometers, anemometers and flow meters. A new micro-link structure is also proposed to enhance the construction of accelerometer with the micro heater and two pairs of thermopiles floating over an etched cavity. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining the sensor to evaluate the performance of this accelerometer.
| Original language | English |
|---|---|
| Title of host publication | Advanced Manufacture |
| Subtitle of host publication | Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture |
| Publisher | Trans Tech Publications Ltd |
| Pages | 84-89 |
| Number of pages | 6 |
| ISBN (Print) | 9770255547605 |
| DOIs | |
| Publication status | Published - 2008 Jan 1 |
| Event | 2007 SME International Conference on Advanced Manufacture, SME ICAM 2007 - Tainan, Taiwan Duration: 2008 Nov 26 → 2008 Nov 28 |
Publication series
| Name | Materials Science Forum |
|---|---|
| Volume | 594 |
| ISSN (Print) | 0255-5476 |
Other
| Other | 2007 SME International Conference on Advanced Manufacture, SME ICAM 2007 |
|---|---|
| Country | Taiwan |
| City | Tainan |
| Period | 08-11-26 → 08-11-28 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Cite this
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Researches of a novel 2D CMOS thermal based accelerometer. / Shen, Chih Hsiung; Chen, Shu Jung; Yang, Yin Ting.
Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture. Trans Tech Publications Ltd, 2008. p. 84-89 (Materials Science Forum; Vol. 594).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Researches of a novel 2D CMOS thermal based accelerometer
AU - Shen, Chih Hsiung
AU - Chen, Shu Jung
AU - Yang, Yin Ting
PY - 2008/1/1
Y1 - 2008/1/1
N2 - Conventionally the accelerometer behaves like a spring - mass system and its structures involve solid proof mass, which is allowed to move under acceleration conditions. In this paper, we design and fabrication a novel thermal-bubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. The proposed accelerometer based on thermal convection creates a tiny heated air bubble hermetically sealed inside the sensor package cavity. Four thermopiles around the center heater serve as the temperature sensors to detect two-dimension motion of the chip and also are adequately applied to the technology of inclinometers, anemometers and flow meters. A new micro-link structure is also proposed to enhance the construction of accelerometer with the micro heater and two pairs of thermopiles floating over an etched cavity. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining the sensor to evaluate the performance of this accelerometer.
AB - Conventionally the accelerometer behaves like a spring - mass system and its structures involve solid proof mass, which is allowed to move under acceleration conditions. In this paper, we design and fabrication a novel thermal-bubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. The proposed accelerometer based on thermal convection creates a tiny heated air bubble hermetically sealed inside the sensor package cavity. Four thermopiles around the center heater serve as the temperature sensors to detect two-dimension motion of the chip and also are adequately applied to the technology of inclinometers, anemometers and flow meters. A new micro-link structure is also proposed to enhance the construction of accelerometer with the micro heater and two pairs of thermopiles floating over an etched cavity. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining the sensor to evaluate the performance of this accelerometer.
UR - http://www.scopus.com/inward/record.url?scp=58049138306&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=58049138306&partnerID=8YFLogxK
U2 - 10.4028/0-87849-360-3.84
DO - 10.4028/0-87849-360-3.84
M3 - Conference contribution
AN - SCOPUS:58049138306
SN - 9770255547605
T3 - Materials Science Forum
SP - 84
EP - 89
BT - Advanced Manufacture
PB - Trans Tech Publications Ltd
ER -