Researches of a novel 2D CMOS thermal based accelerometer

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Conventionally the accelerometer behaves like a spring - mass system and its structures involve solid proof mass, which is allowed to move under acceleration conditions. In this paper, we design and fabrication a novel thermal-bubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. The proposed accelerometer based on thermal convection creates a tiny heated air bubble hermetically sealed inside the sensor package cavity. Four thermopiles around the center heater serve as the temperature sensors to detect two-dimension motion of the chip and also are adequately applied to the technology of inclinometers, anemometers and flow meters. A new micro-link structure is also proposed to enhance the construction of accelerometer with the micro heater and two pairs of thermopiles floating over an etched cavity. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining the sensor to evaluate the performance of this accelerometer.

Original languageEnglish
Title of host publicationAdvanced Manufacture
Subtitle of host publicationFocusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture
PublisherTrans Tech Publications Ltd
Number of pages6
ISBN (Electronic)978-0-87849-360-9
Publication statusPublished - 2008 Jan 1
Event2007 SME International Conference on Advanced Manufacture, SME ICAM 2007 - Tainan, Taiwan
Duration: 2008 Nov 262008 Nov 28

Publication series

NameMaterials Science Forum
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752


Other2007 SME International Conference on Advanced Manufacture, SME ICAM 2007

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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